PDF, 3.2 Mb, 修订版: C, 档案已发布: Nov 3, 2011
PDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:href=http://processors.wiki.ti.com/index.php/Am3715_gpmcThe GPMC is a 16-bit external memory controller. The GPMC data access engine provides a flexible programming model for communicatio
PDF, 739 Kb, 档案已发布: Jun 15, 2011
The purpose of a power distribution network (PDN) is to provide clean and reliable power to active devices in the system. The printed circuit board (PCB) is a critical component of the system-level PDN. Therefore, the PCB design is of utmost importance for high-performance low-power microprocessors. This application report provides design requirements and details a step-by-step methodology on how
PDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x/DM37x_Schematic_Checklist.This article provides many tips related to reset, JTAG, peripherals, etc. It should be used as
PDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_EVM_Software_Developer%27s_Guide.This wiki article illustrates the various software components provided with the A
PDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Overview.This document provides an overview of the AM37x applications processor.All trademarks are property of their respective
PDF, 20 Kb, 档案已发布: Jun 7, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or tocontribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Power_Estimation_SpreadsheetThis article discusses the power consumption of the Texas Instruments AM/DM37x high
PDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Ethernet_Connectivity_via_GPMCThe purpose of this article is to describe a solution for connecting Ethernet to various devices,
PDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Setting_up_AM37x_SDRC_registersThis wiki article describes how to set the SDRC registers in the OMAP35x SDRC module depending o
PDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_CUS_Routing_Guidelines.CUS package is designed with a new technology called Via Channelв„ў array. This technology allows for e
PDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_Memory_SubsystemThe Memory Subsystem in the AM3715/03 devices consists of the internal SRAM and two dedicated memory contr
PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
Application Note 1281 Bumped Die (Flip Chip) Packages
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Nov 1, 2013Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.
PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char
PDF, 6.7 Mb, 修订版: B, 档案已发布: Jun 13, 2009
Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
PDF, 1.2 Mb, 档案已发布: Jun 23, 2010
Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process
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Jun 23, 2010Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.
Fine-pitch PCB design is a team effort and may require more than
PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
PDF, 535 Kb, 档案已发布: Oct 6, 2011
The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then
