Datasheet Texas Instruments MSP430FR5735IDA — 数据表
| 制造商 | Texas Instruments |
| 系列 | MSP430FR5735 |
| 零件号 | MSP430FR5735IDA |
MSP430FR5735具有8 KB FRAM，1 KB SRAM，32 IO，10位ADC和比较器38-TSSOP的24 MHz ULP微控制器-40至85
数据表
MSP430FR573x Mixed-Signal Microcontrollers datasheet
PDF, 2.3 Mb, 修订版: K, 档案已发布: Apr 25, 2016
从文件中提取
价格
状态
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
打包
| Pin | 38 |
| Package Type | DA |
| Industry STD Term | TSSOP |
| JEDEC Code | R-PDSO-G |
| Package QTY | 40 |
| Carrier | TUBE |
| Device Marking | M430FR5735 |
| Width (mm) | 6.2 |
| Length (mm) | 12.5 |
| Thickness (mm) | 1.15 |
| Pitch (mm) | .65 |
| Max Height (mm) | 1.2 |
| Mechanical Data | 下载 |
参数化
| ADC | ADC10 - 12ch |
| AES | N/A |
| Active Power | 91.667 uA/MHz |
| Additional Features | Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA |
| BSL | UART |
| CPU | MSP430 |
| Comparators | 16 |
| DMA | 3 |
| Featured | fr5 |
| Frequency | 24 MHz |
| GPIO Pins | 32 |
| I2C | 1 |
| Max VCC | 3.6 |
| Min VCC | 2 |
| Multiplier | 32x32 |
| Non-volatile Memory | 8 KB |
| Operating Temperature Range | -40 to 85 C |
| Package Group | TSSOP |
| Package Size: mm2:W x L | 38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) PKG |
| RAM | 1 KB |
| Rating | Catalog |
| SPI | 3 |
| Security Enabler | Cryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection |
| Special I/O | N/A |
| Standby Power | 6.4 LPM3-uA |
| Timers - 16-bit | 5 |
| UART | 2 |
| Wakeup Time | 78 us |
生态计划
| RoHS | Compliant |
设计套件和评估模块
- Evaluation Modules & Boards: MSP-TS430RHA40A
MSP-TS430RHA40A- 40-pin Target Development Board for MSP430FRxx FRAM MCUs
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: MSP-FET430U40A
40-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F5x MCUs
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: ENERGYTRACE
MSP EnergyTrace Technology
Lifecycle Status: Active (Recommended for new designs)
应用须知
- Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)PDF, 3.5 Mb, 修订版: A, 档案已发布: Mar 2, 2015
- MSP430 System-Level ESD ConsiderationsPDF, 1.5 Mb, 档案已发布: Mar 29, 2012
System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs:(1) Component-level ESD testing and system-level ESD testing, their differ - Maximizing Write Speed on the MSP430в„ў FRAM (Rev. B)PDF, 103 Kb, 修订版: B, 档案已发布: Feb 4, 2015
Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430в„ў FRAM-based devices, and discusses tradeoffs such as - MSP430 FRAM Technology – How To and Best PracticesPDF, 326 Kb, 档案已发布: Jun 23, 2014
FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif - MSP430 FRAM Quality and Reliability (Rev. A)PDF, 295 Kb, 修订版: A, 档案已发布: May 1, 2014
FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura - Migrating from the USCI Module to the eUSCI Module (Rev. A)PDF, 41 Kb, 修订版: A, 档案已发布: Sep 13, 2012
The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules. - Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)PDF, 154 Kb, 修订版: A, 档案已发布: Feb 16, 2012
This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl模型线
系列: MSP430FR5735 (4)- MSP430FR5735IDA MSP430FR5735IDAR MSP430FR5735IRHAR MSP430FR5735IRHAT
制造商分类
- Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430FRxx FRAM