Datasheet Fairchild FQP13N10L — 数据表
制造商 | Fairchild |
系列 | FQP13N10L |
零件号 | FQP13N10L |
N沟道QFET MOSFET 100 V,12.8 A,180mΩ
数据表
FQP13N10L -N-Channel QFET® MOSFET December 2013 FQP13N10L
N-Channel QFET® MOSFET
100 V, 12.8 A, 180 m Description Features This N-Channel enhancement mode power MOSFET is produced using Fairchild Semiconductor's proprietary planar stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state resistance, and to provide superior switching performance and high avalanche energy strength. These devices are suitable for switched mode power supplies, audio amplifier, DC motor control, and variable switching power applications. 12.8 A, 100 V, RDS(on) = 180 m (Max.) @ VGS = 10 V, ID = 6.4 A Low Gate Charge (Typ. 8.7 nC) Low Crss (Typ. 20 pF) 100% Avalanche Tested 175°C Maximum Junction Temperature Rating D GD S TO-220 G S Absolute Maximum Ratings
Symbol VDSS ID IDM VGSS EAS IAR EAR dv/dt PD TJ, TSTG TL TC = 25°C unless otherwise noted. Parameter Drain-Source Voltage -Continuous (TC = 25°C) Drain Current -Continuous (TC = 100°C) Drain Current -Pulsed
(Note 1) FQP13N10L 100 12.8 9.05 51.2 20
(Note 2) (Note 1) (Note 1) (Note 3) Unit V A A A V mJ A mJ V/ns W W/°C °C °C Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25°C) -Derate above 25°C Operating and Storage Temperature Range Maximum lead temperature for soldering, 1/8" from case for 5 seconds. 95 12.8 6.5 6.0 65 0.43 -55 to +175 300 Thermal Characteristics + + FQP13N10L 2.31 -' & Thermal Resistance, Junction-to-Case, Max. Thermal Resistance, Junction-to-Ambient, Max. 6? 6? ©2000 Fairchild Semiconductor Corporation FQP13N10L Rev. C1 1 www.fairchildsemi.com FQP13N10L -N-Channel QFET® MOSFET Package Marking and Ordering Information
Part Number FQP13N10L Top Mark FQP13N10L Package TO-220 Packing Method Tube Reel Size N/A Tape Width N/A Quantity 50 units Electrical Characteristics Off Characteristics
BVDSS BVDSS / TJ IDSS IGSSF IGSSR Symbol Parameter TC = 25°C unless otherwise noted Test Conditions Min. Typ. Max. Unit Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse VGS = 0 V, ID = 250 A ID = 250 A, Referenced to 25°C VDS = 100 V, VGS = 0 V VDS = 80 V, TC = 150°C VGS = 20 V, VDS = 0 V VGS = -20 V, VDS = 0 V 100 --0.09 --1 10 100 -100 V V/°C A A nA nA On Characteristics
VGS(th) RDS(on) Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance VDS = VGS, ID = 250 A VGS = 10 V, ID = 6.4 A VGS = 5 V, ID = 6.4 A VDS = 30 V, ID = 6.4 …
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详细说明
这款N沟道增强型功率MOSFET使用飞兆半导体专有的平面条纹和DMOS技术生产。这项先进的MOSFET技术经过特别设计,可降低导通电阻,并提供出色的开关性能和高雪崩能量强度。这些设备适用于开关电源,音频放大器,直流电动机控制和可变开关电源应用。
模型线
- FQP13N10L PCFQ13N10LW
制造商分类
- Discretes > FETs > MOSFETs