Datasheet Texas Instruments LDC1612DNTT — 数据表
制造商 | Texas Instruments |
系列 | LDC1612 |
零件号 | LDC1612DNTT |
具有I2C的2通道,28位电感数字转换器,用于感应式12-WSON -40至125
数据表
LDC1612, LDC1614 Multi-Channel 28-Bit Inductance to Digital Converter (LDC) for Inductive Sensing datasheet
PDF, 1.8 Mb, 档案已发布: Nov 17, 2014
从文件中提取
价格
状态
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | Yes |
打包
Pin | 12 |
Package Type | DNT |
Industry STD Term | WSON |
JEDEC Code | S-PDSO-N |
Package QTY | 250 |
Carrier | SMALL T&R |
Device Marking | LDC1612 |
Width (mm) | 4 |
Length (mm) | 4 |
Thickness (mm) | .75 |
Pitch (mm) | .5 |
Max Height (mm) | .8 |
Mechanical Data | 下载 |
参数化
# Input Channels | 2 |
Active Supply Current(Typ) | 2.1 mA |
Analog Supply (V) | 2.7 Max |
Interface | I2C |
L (Inductance) Resolution | 28 Bits |
Operating Temperature Range | -40 to 125 C |
Oscillation Amplitude(Max) | 1.8 V |
Oscillation Amplitude(Min) | 0.7 V |
Package Group | WSON |
Package Size: mm2:W x L | See datasheet (WSON) PKG |
Rating | Catalog |
Response Time(Max) | N/A 1/fsensor |
Response Time(Min) | 245 1/fsensor |
Rp (Parallel Resonance Impedance) Resolution | N/A Bits |
Sensor Frequency | 1k to 10M Hz |
Sensor Rp Range(Max) | 100K Ohms |
Sensor Rp Range(Min) | 250 Ohms |
Stand-By Current(Typ) | 35 uA |
生态计划
RoHS | Compliant |
设计套件和评估模块
- Evaluation Modules & Boards: LDCCOILEVM
Reference Coil Board Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: LDC1612EVM
LDC1612 Evaluation Module for Inductance to Digital Converter with Sample PCB Coils
Lifecycle Status: Active (Recommended for new designs)
应用须知
- Inductive Sensing Touch-On-Metal Buttons Design GuidePDF, 2.6 Mb, 档案已发布: Mar 30, 2016
- LDC1612 LDC1614 Linear Position SensingPDF, 239 Kb, 档案已发布: Apr 20, 2015
This application note explains how both approaches can be used to determine the position of a target that is moved laterally above the sensor coil and provides system design guidelines for each approach. Resolution calculations are based on the 28-bit devices LDC1612 and LDC1614, but the same principles apply to other LDCs such as LDC1000, LDC1041, LDC1312, and LDC1314. - Power Reduction Techniques for the LDC131x/161x for Inductive SensingPDF, 215 Kb, 档案已发布: Mar 18, 2016
Inductive sensing is a contactless technique for applications ranging from position or motion measurement of a conductive target to detection of spring compression or extension. Depending on the specific application, there are different system requirements regarding sensitivity, responsiveness, and power. Power consumption is a key parameter for many applications, including wearables, consumer ele - Optimizing L Measurement Resolution for the LDC161x and LDC1101PDF, 108 Kb, 档案已发布: Feb 12, 2016
- LDC1312, LDC1314, LDC1612, LDC1614 Sensor Status MonitoringPDF, 102 Kb, 档案已发布: Oct 9, 2016
TI’s multichannel inductance-to-digital converters (LDCs) LDC1612, LDC1614, LDC1312 and LDC1314feature three different methods for reporting conversion status information including errors, warnings, andcompleted conversion results. Information is available through the data registers, the status registers, andthe INTB pin of the device. This application note explains usage and interpretation - Configuring Inductive-to-Digital-Converters for Parallel Resistance (RP) Variati (Rev. A)PDF, 255 Kb, 修订版: A, 档案已发布: Jun 1, 2015
This application note reviews sensor RP configuration for LDC devices. LDC1000, LDC1041, LDC1051, LDC1312, LDC1314, LDC1612, LDC1614 are covered in this note. Clear understanding on how to set the RP_MIN and RP_MAX registers is necessary for not only RP measurements, but also for optimum L measurements. The fundamental principle of RP measurements is that magnetic fields from an LC circuit ge - Setting LDC1312/4, LDC1612/4, and LDC1101 Sensor Drive ConfigurationPDF, 298 Kb, 档案已发布: Apr 5, 2016
- EMI Considerations for Inductive SensingPDF, 151 Kb, 档案已发布: Feb 22, 2017
This application note explains various EMI reduction techniques to help improve EMI performance for TI'sInductance-to-Digital Converters (LDC). Each section details a general technique with references to otheruseful online documents. A list of relevant EMI reduction techniques is provided for specific devices withinthe LDC family of products. - LDC Device Selection Guide (Rev. B)PDF, 360 Kb, 修订版: B, 档案已发布: Mar 21, 2017
- LDC Sensor DesignPDF, 1.0 Mb, 档案已发布: Mar 24, 2015
Getting the best performance out of an LDC requires a sensor suitable for the measurement. This app-note covers the parameters to consider when designing a sensor for a specific application. Specific areas of focus include the physical routing characteristics of PCB based sensors, considerations for the sensor capacitor, and techniques to minimize or compensate for parasitic effects. - LDC1xxx LDC Target Design (Rev. A)PDF, 907 Kb, 修订版: A, 档案已发布: May 9, 2017
Texas Instruments’ Inductive-to-Digital Converter (LDC) technology can accurately measure with a wide variety of target sizes, shapes, and material composition. There are several target design guidelines to maximize the effectiveness of an LDC measurement system. This application note covers the relevant factors of target design that affect inductive sensing, and provides guide - Measuring Rp of an L-C Sensor for Inductive SensingPDF, 205 Kb, 档案已发布: Oct 1, 2015
When designing an application using TI’s LDC series of inductive sensors, it is necessary to know the L-C sensor’s equivalent parallel resistance RP at the sensor’s resonant frequency. The RP value changes as the target is moved; the minimum RP occurs when the metal target is closest to the sensor. The maximum RP occurs when the target is at the farthest distance. Accordingly, both values should b
模型线
系列: LDC1612 (2)
- LDC1612DNTR LDC1612DNTT
制造商分类
- Semiconductors > Sensing Products > Inductive Sensing > Inductance to Digital Converters