Datasheet Texas Instruments TMX320C6670CYP — 数据表

制造商Texas Instruments
系列TMS320C6670
零件号TMX320C6670CYP
Datasheet Texas Instruments TMX320C6670CYP

多核定点和浮点片上系统841-FCBGA 0至85

数据表

TMS320C6670 Multicore Fixed and Floating-Point System-on-Chip datasheet
PDF, 2.4 Mb, 修订版: D, 档案已发布: Mar 7, 2012
从文件中提取

价格

状态

Lifecycle StatusObsolete (Manufacturer has discontinued the production of the device)
Manufacture's Sample AvailabilityNo

打包

Pin841
Package TypeCYP
Width (mm)24
Length (mm)24
Thickness (mm)2.82
Mechanical Data下载

参数化

ApplicationsCommunications and Telecom
Approx. Price (US$)168.00 | 1ku
DRAMDDR3
DSP4 C66x
DSP MHz (Max.)1000
1200
EMAC10/100/1000
GFLOPS64
76.8
Hardware AcceleratorsVCP2
TCP3d
TCP3e
FFT Coprocessor
On-Chip L2 Cache4096 KB
Operating Temperature Range(C)-40 to 100
0 to 85
Other On-Chip Memory2048 KB
PCI/PCIe2 PCIe Gen2
Package Size: mm2:W x L (PKG)See datasheet (FCBGA)
RatingCatalog
Serial I/OAIF2
I2C
RapidIO
SPI
UART
Serial RapidIO1 (four lanes)
Total On-Chip Memory (KB)6528

生态计划

RoHSNot Compliant
Pb FreeNo

设计套件和评估模块

  • Development Kits: TMDSEVM6670
    TMS320C6670 Evaluation Modules
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: TMDSEVM6678
    TMS320C6678 Evaluation Modules
    Lifecycle Status: Active (Recommended for new designs)
  • Daughter Cards: TMDXEVMPCI
    AMC to PCIe Adapter Card
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: HL5CABLE
    Hyperlink Cable
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • AIF1-to-AIF2 Antenna Interface Migration Guide for KeyStone Devices
    PDF, 640 Kb, 档案已发布: Nov 9, 2010
  • Connecting AIF to FFTC Guide for KeyStone Devices
    PDF, 441 Kb, 档案已发布: Nov 9, 2010
  • Keystone NDK FAQ
    PDF, 54 Kb, 档案已发布: Oct 3, 2016
    This document is a collection of frequently asked questions (FAQ) on running the NDK examples on the KeyStoneв„ў family of devices.
  • TI Keystone DSP Hyperlink SerDes IBIS-AMI Models
    PDF, 3.2 Mb, 档案已发布: Oct 9, 2014
    This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP Hyperlink interface.
  • TI Keystone DSP PCIe SerDes IBIS-AMI Models
    PDF, 4.8 Mb, 档案已发布: Oct 9, 2014
    This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP PCIe interface.
  • SerDes Implementation Guidelines for KeyStone I Devices
    PDF, 590 Kb, 档案已发布: Oct 31, 2012
    The goal of KeyStone I SerDes collateral material is to make system implementation easier for the customer by providing the system solution. For these SerDes-based interfaces, it is not assumed that the system designer is familiar with the industry specifications, SerDes technology, or RF/microwave PCB design. However, it is still expected that the PCB design work will be supervised by a knowledge
  • KeyStone I DDR3 Initialization (Rev. E)
    PDF, 114 Kb, 修订版: E, 档案已发布: Oct 28, 2016
    The initialization of the DDR3 DRAM controller on KeyStone I DSPs is straightforward as long as the proper steps are followed. However, if some steps are omitted or if some sequence-sensitive steps are implemented in the wrong order, DDR3 operation will be unpredictable.All DDR3 initialization routines must contain the basic register writes to configure the memory controller within the DSP
  • TMS320C66x DSP Generation of Devices (Rev. A)
    PDF, 245 Kb, 修订版: A, 档案已发布: Apr 25, 2011
  • Hardware Design Guide for KeyStone Devices (Rev. C)
    PDF, 1.7 Mb, 修订版: C, 档案已发布: Sep 15, 2013
  • Tuning VCP2 and TCP2 Bit Error Rate Performance
    PDF, 293 Kb, 档案已发布: Feb 11, 2011
    In most customer applications, a high level of decoding bit error rate (BER) performance is required. Since Convolutional codes and Turbo codes are widely used in wireless communication systems, TI DSPs integrate two high-performance embedded coprocessors (enhanced Viterbi decoder coprocessor and enhanced Turbo decoder coprocessor) that significantly speed up channel-decoding operations on-chip.
  • SERDES Link Commissioning on KeyStone I and II Devices
    PDF, 138 Kb, 档案已发布: Apr 13, 2016
    The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
  • PCIe Use Cases for KeyStone Devices
    PDF, 320 Kb, 档案已发布: Dec 13, 2011
  • The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
    PDF, 20 Kb, 修订版: A, 档案已发布: Nov 10, 2010
    The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
  • Optimizing Loops on the C66x DSP
    PDF, 585 Kb, 档案已发布: Nov 9, 2010
  • Clocking Design Guide for KeyStone Devices
    PDF, 1.5 Mb, 档案已发布: Nov 9, 2010
  • DDR3 Design Requirements for KeyStone Devices (Rev. B)
    PDF, 582 Kb, 修订版: B, 档案已发布: Jun 5, 2014
  • Multicore Programming Guide (Rev. B)
    PDF, 1.8 Mb, 修订版: B, 档案已发布: Aug 29, 2012
    As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require

模型线

制造商分类

  • Semiconductors > Processors > Digital Signal Processors > C6000 DSP > C66x DSP