Datasheet Texas Instruments 66AK2H14BXAAW24 — 数据表

制造商	Texas Instruments
系列	66AK2H14
零件号	66AK2H14BXAAW24

多核DSP + ARM KeyStone II片上系统（SoC）1517-FCBGA 0至85

数据表

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PDF, 2.4 Mb, 修订版: F, 档案已发布: Jun 2, 2017

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价格

状态

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	No

打包

Pin	1517	1517	1517
Package Type	AAW	AAW	AAW
Package QTY	21	21	21
Device Marking	1.2GHZ/1.4GHZ	66AK2H14XAAW	@2012 TI
Width (mm)	40	40	40
Length (mm)	40	40	40
Thickness (mm)	3.07	3.07	3.07
Mechanical Data	下载	下载	下载

参数化

ARM CPU	4 ARM Cortex-A15
ARM MHz	1200,1400 Max.
Applications	Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space
DRAM	DDR3,DDR3L
DSP	8 C66x
DSP MHz	1200 Max.
EMAC	10G Ethernet
Hardware Accelerators	Packet Accelerator,Security Accelerator
I2C	3
On-Chip L2 Cache	4096 KB (ARM Cluster),1024 KB (per C66x DSP core)
Operating Systems	Integrity,Linux,SYS/BIOS,VxWorks
Operating Temperature Range	-40 to 100,0 to 85 C
Other On-Chip Memory	6144 KB
PCI/PCIe	2 PCIe Gen2
Rating	Catalog
SPI	3
UART	2 SCI
USB	1

生态计划

RoHS

Compliant

设计套件和评估模块

Evaluation Modules & Boards: EVMK2H
66AK2H Evaluation Modules
Lifecycle Status: Active (Recommended for new designs)
JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
XDS560v2 System Trace USB Debug Probe
Lifecycle Status: Active (Recommended for new designs)
JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
XDS560v2 System Trace USB & Ethernet Debug Probe
Lifecycle Status: Active (Recommended for new designs)
JTAG Emulators/ Analyzers: TMDSEMU200-U
XDS200 USB Debug Probe
Lifecycle Status: Active (Recommended for new designs)

应用须知

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PCI Express (PCIe) Resource Wiki for Keystone Devices (Rev. A)
PDF, 57 Kb, 修订版: A, 档案已发布: May 19, 2017
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Keystone II DDR3 Initialization
PDF, 73 Kb, 档案已发布: Jan 26, 2015
This application report provides a step-to-step initialization guide for the Keystone II device DDR3 SDRAM controller.
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Throughput Performance Guide for KeyStone II Devices (Rev. B)
PDF, 866 Kb, 修订版: B, 档案已发布: Dec 22, 2015
This application report analyzes various performance measurements of the KeyStone II family of processors. It provides a throughput analysis of the various support peripherals to different end-points and memory access.
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Keystone II DDR3 Debug Guide
PDF, 143 Kb, 档案已发布: Oct 16, 2015
This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device.
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Power Management of KS2 Device (Rev. C)
PDF, 61 Kb, 修订版: C, 档案已发布: Jul 15, 2016
This application report lists the steps to enable Class 0 Temperature Compensation (Class 0 TC) mode of SmartReflexв„ў Subsystem (SRSS) module available on such devices.
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Hardware Design Guide for KeyStone II Devices
PDF, 1.8 Mb, 档案已发布: Mar 24, 2014
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SERDES Link Commissioning on KeyStone I and II Devices
PDF, 138 Kb, 档案已发布: Apr 13, 2016
The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
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PCIe Use Cases for KeyStone Devices
PDF, 320 Kb, 档案已发布: Dec 13, 2011
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The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
PDF, 20 Kb, 修订版: A, 档案已发布: Nov 10, 2010
The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: вЂњint gvar;вЂќ gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
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Clocking Design Guide for KeyStone Devices
PDF, 1.5 Mb, 档案已发布: Nov 9, 2010
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Optimizing Loops on the C66x DSP
PDF, 585 Kb, 档案已发布: Nov 9, 2010
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DDR3 Design Requirements for KeyStone Devices (Rev. B)
PDF, 582 Kb, 修订版: B, 档案已发布: Jun 5, 2014
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Multicore Programming Guide (Rev. B)
PDF, 1.8 Mb, 修订版: B, 档案已发布: Aug 29, 2012
As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
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Processor SDK RTOS Audio Benchmark Starter Kit
PDF, 530 Kb, 档案已发布: Apr 12, 2017
The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device
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TI DSP Benchmarking
PDF, 62 Kb, 档案已发布: Jan 13, 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.

模型线

系列: 66AK2H14 (6)

66AK2H14BAAW24 66AK2H14BAAWA24 66AK2H14BXAAW24 66AK2H14DAAW24 66AK2H14DAAWA24 66AK2H14DXAAWA24

制造商分类

Semiconductors > Processors > Digital Signal Processors > C6000 DSP + ARM Processors > 66AK2x