PDF, 133 Kb, 修订版: A, 档案已发布: Dec 1, 1993
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SCBS060A -JUNE 1990 -REVISED DECEMBER 1993 DW OR NT PACKAGE
(TOP VIEW) State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
Designed to Facilitate Incident-Wave
Switching for Line Impedances of 25 Ω
or Greater
Distributed VCC and GND Pins Minimize
Noise Generated by the Simultaneous
Switching of Outputs
Data Flow-Through Pinout (All Inputs
on Opposite Side From Outputs)
High-Impedance State During Power Up
and Power Down
ESD Protection Exceeds 2000 V
Per MIL-STD-883C, Method 3015
Package Options Include Plastic
Small-Outline (DW) Packages and Standard
Plastic 300-mil DIPs (NT) A1
GND
A2
A3 …