Data sheet acquired from Harris Semiconductor
SCHS073C -Revised October 2003 The CD4512B-series types are supplied in
16-lead hermetic dual-in-line ceramic
packages (F3A suffix), 16-lead dual-in-line
plastic packages (E suffix), 16-lead
small-outline packages (M, M96, MT, and NSR
suffixes),
and
16-lead
thin
shrink
small-outline packages (PW and PWR
suffixes). Copyright пЈ© 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) CD4512BE ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4512BE CD4512BEE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4512BE CD4512BF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD4512BF CD4512BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD4512BF3A CD4512BM ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4512BM CD4512BM96 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4512BM CD4512BM96G4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4512BM CD4512BMG4 ACTIVE SOIC D 16 40 Green (RoHS …