Datasheet Texas Instruments 74ALVC164245DGGTG4 — 数据表
制造商 | Texas Instruments |
系列 | SN74ALVC164245 |
零件号 | 74ALVC164245DGGTG4 |
具有三态输出的16位2.5V至3.3V / 3.3V至5V电平转换收发器48-TSSOP -40至85
数据表
SN74ALVC164245 16-Bit 2.5-V to 3.3-V or 3.3-V to 5-V Level-Shifting Transceiver With 3-State Outputs datasheet
PDF, 1.1 Mb, 修订版: Q, 档案已发布: Sep 27, 2016
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价格
状态
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | No |
打包
Pin | 48 |
Package Type | DGG |
Industry STD Term | TSSOP |
JEDEC Code | R-PDSO-G |
Package QTY | 250 |
Carrier | SMALL T&R |
Device Marking | ALVC164245 |
Width (mm) | 6.1 |
Length (mm) | 12.5 |
Thickness (mm) | 1.15 |
Pitch (mm) | .5 |
Max Height (mm) | 1.2 |
Mechanical Data | 下载 |
参数化
Bits | 16 |
ICCA Static Current | 0.04 mA |
ICCB Static Current | 0.04 mA |
Package Group | TSSOP |
Package Size: mm2:W x L | 48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) PKG |
Rating | Catalog |
Special Features | N/A |
Static Current | 0.04 mA |
VCCA(Max) | 3.3 V |
VCCA(Min) | 2.5 V |
VCCB(Max) | 5 V |
VCCB(Min) | 3.3 V |
生态计划
RoHS | Compliant |
应用须知
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Design of high-performance personal computer (PC) systems that are capable of meeting the needs imposed by modern operating systems and software includes the use of large banks of SDRAMs on DIMMs (see Figure 1).To meet the demands of stable functionality over the broad spectrum of operating environments, meet system timing needs, and to support data integrity, the loads presented by the large - TI SN74ALVC16835 Component Specification Analysis for PC100PDF, 43 Kb, 档案已发布: Aug 3, 1998
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TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa - Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi - Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)PDF, 154 Kb, 修订版: A, 档案已发布: Sep 8, 1999
In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families - Understanding Advanced Bus-Interface Products Design GuidePDF, 253 Kb, 档案已发布: May 1, 1996
- Migration From 3.3-V To 2.5-V Power Supplies For Logic DevicesPDF, 115 Kb, 档案已发布: Dec 1, 1997
This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn - TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Kb, 档案已发布: Aug 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con - Live InsertionPDF, 150 Kb, 档案已发布: Oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - CMOS Power Consumption and CPD Calculation (Rev. B)PDF, 89 Kb, 修订版: B, 档案已发布: Jun 1, 1997
Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale - Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Mb, 档案已发布: Oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
模型线
系列: SN74ALVC164245 (15)
制造商分类
- Semiconductors > Logic > Voltage Level Translation > Application Specific Voltage Translation