Datasheet Texas Instruments MSP430FR4133IG56R — 数据表

制造商	Texas Instruments
系列	MSP430FR4133
零件号	MSP430FR4133IG56R

数据表

价格

状态

打包

参数化

生态计划

设计套件和评估模块

• Evaluation Modules & Boards: MSP-FET430U64D
  Target development board (64-pin) and MSP-FET programmer bundle for MSP430FR2x/4x MCUs
  Lifecycle Status: Active (Recommended for new designs)
  
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• Evaluation Modules & Boards: MSP-EXP430FR4133
  MSP430FR4133 LaunchPad Development Kit
  Lifecycle Status: Active (Recommended for new designs)
  
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• Evaluation Modules & Boards: MSP-TS430PM64D
  Target Development Board – 64 pins – for MSP430FR2x/4x MCUs
  Lifecycle Status: Active (Recommended for new designs)
  
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• JTAG Emulators/ Analyzers: ENERGYTRACE
  MSP EnergyTrace Technology
  Lifecycle Status: Active (Recommended for new designs)
  
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应用须知

• 下载
  RF430FRL152H NFC Sensor Tag Application Example With MSP430 Microcontrollers
  PDF, 600 Kb, 档案已发布: Oct 11, 2016
  Analog and digital sensors coupled together with wireless technology is an expanding use case across many different areas of growing technology such as diagnostics, data logging, and medical. Near Field Communication (NFC) technology has emerged as a viable option for many of those applications that can benefit from utilizing a contactless short-range wireless solution.Texas Instruments offers t
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  Software I2C on MSP430 MCUs
  PDF, 126 Kb, 档案已发布: May 18, 2016
  Hardware and layout limitations often require smaller package sizes that could potentially create a tradeoff for the number of serial peripherals available to the user. With the I2C protocol, special software can be created to use a pair of simple GPIO ports to emulate an I2C master device. This allows programmers to be flexible with pin assignments and enables smaller package devices to overcome
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  Infrared Remote Control Implementation With MSP430FR4xx (Rev. B)
  PDF, 329 Kb, 修订版: B, 档案已发布: Jun 30, 2015
  This application report provides an insight into several of the most frequently used infrared protocols and especially their flexible implementation using the TI MSP430FR4xx series of low-power microcontrollers.The MSP430FR4xx microcontrollers are primarily targeted at remote control application that are equipped with infrared modulation function and an LCD display. The infrared modulation combi
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  Migrating from the MSP430F4xx to Family to the MSP430FR4xx Family
  PDF, 194 Kb, 档案已发布: Oct 3, 2014
  This application report enables easy migration from MSP430F4xx flash-based MCUs to the MSP430FR4xx/FR2xx family of FRAM-based MCUs. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx/FR2xx devices, see the MSP430FR4xx and MSP430FR2xx Family User
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  VLO Calibration on the MSP430FR4xx and MSP430FR2xx Family (Rev. A)
  PDF, 78 Kb, 修订版: A, 档案已发布: Feb 19, 2016
  MSP430FR4xx and MSP430FR2xx (FR4xx/FR2xx) family microcontrollers (MCUs) provide various clock sources, including some high-speed high-accuracy clocks and some low-power low-system-cost clocks. Users can select the best balance of performance, power consumption, and system cost. The on-chip very low-frequency oscillator (VLO) is a clock source with 10-kHz typical frequency included in FR4xx/FR2xx
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  MSP430 FRAM Technology – How To and Best Practices
  PDF, 326 Kb, 档案已发布: Jun 23, 2014
  FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
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  MSP430 FRAM Quality and Reliability (Rev. A)
  PDF, 295 Kb, 修订版: A, 档案已发布: May 1, 2014
  FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
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  MSP430 Embedded Application Binary Interface
  PDF, 596 Kb, 档案已发布: May 16, 2012
  This document is a specification for the ELF-based Embedded Application Binary Interface (EABI) for the MSP430 family of processors from Texas Instruments. The EABI defines the low-level interface between programs, program components, and the execution environment, including the operating system if one is present. Components of the EABI include calling conventions, data layout and addressing conve
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  Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)
  PDF, 237 Kb, 修订版: E, 档案已发布: May 4, 2018
  This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430
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  Designing With MSP430 and Segment LCDs (Rev. A)
  PDF, 2.1 Mb, 修订版: A, 档案已发布: Jul 20, 2015
  Segment liquid crystal displays (LCDs) are needed to provide information to users in a wide variety of applications from smart meters to electronic shelf labels (ESL) to medical equipment. Several MSP430в„ў microcontroller families include built-in low-power LCD driver circuitry that allows the MSP430 MCU to directly control the segmented LCD glass. This application note helps explain how segmented
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  General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
  PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
  Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl

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制造商分类

• Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430FRxx FRAM