PDF, 600 Kb, 档案已发布: Nov 1, 2005
TMS320C672x is a floating point device family from Texas Instruments that provides high quality audio performance at low prices. The price/performance ratio makes C672x well suited for numerous audio applications. This application note shows how to use C672x to efficiently create delay-based audio effects. The application note explains:How to leverage the data movement accelerator (dM
PDF, 456 Kb, 修订版: D, 档案已发布: Sep 10, 2009
This application report describes the design details of the TMS320C672x bootloader and describes a set of software utilities designed to facilitate formatting of application code for use with the bootloader.This application report contains a system level patch, the bootloader utilities and project code that can bedownloaded from this link:
PDF, 55 Kb, 修订版: B, 档案已发布: Sep 22, 2006
This document discusses the power consumption of the Texas Instruments TMS320C672x digital signal processor (DSP). Power consumption on TMS320C67x™ devices is highly application-dependent. A spreadsheet is provided to model power consumption for the user’s application. To get good results from the spreadsheet, realistic usage parameters must be entered. The low-core voltage and other power d
PDF, 87 Kb, 修订版: A, 档案已发布: Sep 22, 2006
The DSP Hardware Designer's Resource Guide is organized by development flow and functional areas to make your design effort as seamless as possible. Topics covered include getting started, board design, system testing, and checklists to aid in your initial design and debug efforts. Each section includes pointers to valuable information including technical documentation, models, symbols, and refere
PDF, 60 Kb, 修订版: C, 档案已发布: Sep 25, 2006
Describes the features of the C9230C100 TMS320C672x digital signal processor ROM. The system level patch, bootloader utilities and example code, can be downloaded from this link: http://www-s.ti.com/sc/psheets/sprc203/sprc203.zip.
PDF, 182 Kb, 档案已发布: May 23, 2005
PDF, 127 Kb, 档案已发布: May 20, 2007
As integrated circuit (IC) components become more complex, the challenge of producing an end product with superior thermal performance increases. Thermal performance is a system level concern, impacted by IC packaging as well as by printed circuit board (PCB) design. This application report addresses the thermal considerations for the TMS320DM64xx, TMS320DM64x, and TMS320C6000в„ў DSP devices.
PDF, 125 Kb, 档案已发布: Apr 15, 2009
