Datasheet Texas Instruments TMS320C6474FCUNA — 数据表

制造商Texas Instruments
系列TMS320C6474
零件号TMS320C6474FCUNA
Datasheet Texas Instruments TMS320C6474FCUNA

多核数字信号处理器561-FC / CSP -40至100

数据表

TMS320C6474 Multicore Digital Signal Processor Data Manual datasheet
PDF, 1.8 Mb, 修订版: H, 档案已发布: Apr 11, 2011
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin561561561
Package TypeCUNCUNCUN
Package QTY606060
Device Marking@2006 TITMS320C6474CUNA1GHZ
Width (mm)232323
Length (mm)232323
Thickness (mm)2.652.652.65
Mechanical Data下载下载下载

参数化

DSP3 C64x+
RatingCatalog

生态计划

RoHSCompliant

设计套件和评估模块

  • Development Kits: TMDSEVM6472
    TMS320C6472 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • TMS320C6474 Multicore Digital Signal Processor Technical Brief
    PDF, 288 Kb, 档案已发布: Oct 14, 2008
    The TMS320C6474 DSP integrates three 1-GHz C64x+ DSP CPU cores, a host of high-speed peripherals, and large amounts of internal memory in a compact 23 mm by 23 mm package. These features allow the C6474 device to provide significant performance integration and high-performance density, along with substantial efficiencies in power, cost, and board space.
  • TMS320C6474 Power Consumption Summary
    PDF, 85 Kb, 档案已发布: Oct 14, 2008
    This document discusses the power consumption of the Texas Instruments TMS320C6474 digital signal processor (DSP). The power consumption on the TMS320C6474 device is highly application-dependent; therefore, a power spreadsheet that estimates power consumption is provided along with this application report. This spreadsheet can be used to model power consumption for user applications such as power
  • TMS320C6474 Module Throughput Application Report
    PDF, 140 Kb, 档案已发布: Oct 14, 2008
    This document provides information on the C6474 module throughput.
  • Direct I/O Library
    PDF, 30 Kb, 档案已发布: Aug 28, 2009
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://www.tiexpressdsp.com/index.php/DIO_LibraryThis DIO library aims at providing a CSL-like Serial RapidIO (SRIO) functional layer for the directIO mode of Texas Instruments' TMS320C64
  • TMS320C6474 SERDES Implementation Guidelines
    PDF, 127 Kb, 档案已发布: Oct 14, 2008
    This document contains implementation instructions for the three serializer/deserializer (SERDES) based interfaces on the TMS320C6474 DSP device. These include the Serial RapidIOВ® (SRIO), antenna, and serial gigabit media independent interface (SGMII) interfaces.Serial RapidIO is an industry-standard high-speed switched-packet interconnect. The antenna interface is compatible with two industr
  • TMS320C6474 Hardware Design Guide (Rev. B)
    PDF, 381 Kb, 修订版: B, 档案已发布: Aug 3, 2010
    This document describes hardware system design considerations for the TMS320C6474 device.
  • Connecting Antenna Interface (AIF) With TDM Bridge Chip (IDT 80HFC001)
    PDF, 28 Kb, 档案已发布: Aug 28, 2009
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://tiexpressdsp.com/index.php/AIFThis article was designed for both beginners and advanced users of the Antenna Interface in the embedded processor TMS320C6474 chip support software library. It i
  • TMS320C6474 DDR2 Implementation Guidelines (Rev. A)
    PDF, 96 Kb, 修订版: A, 档案已发布: Aug 4, 2009
    This document provides implementation instructions for the DDR2 interface contained on the C6474 DSP device.
  • Inter-Core Communication on TMS320C6474
    PDF, 961 Kb, 档案已发布: Jan 12, 2009
    Inter-core (also called Inter-CPU or Inter-Processor) communication on the C6474 multi-core DSP devices can be accomplished using the on-chip inter-processor communication (IPC) module. The main function of the IPC module is to provide inter-core interrupts. Optionally, flags can be sent along with an interrupt for implementation or more advanced inter-core communication protocols.The purpose o
  • Using the TMS320C6474 Antenna Interface (AIF) for Inter-DSP Communication
    PDF, 27 Kb, 档案已发布: Aug 28, 2009
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:href=http://wiki.davincidsp.com/index.php/AIF_Inter_DSP_CommunicationThe TMS320C6474 Antenna Interface (AIF) is a CPRI and OBSAI-compliant peripheral whose primary purpose
  • TMS320C6474 Common Bus Architecture (CBA) Throughput
    PDF, 73 Kb, 档案已发布: Oct 14, 2008
    This application report presents common bus architecture protocols and components as main factors for generic throughput analysis. It provides necessary details on the internal bus structure which enables you to estimate system-on-chip (SoC) performance for a given application.
  • How to Approach Inter-Core Communication on TMS320C6474
    PDF, 142 Kb, 档案已发布: Jan 27, 2009
    Today's digital signal processor (DSP) architectures are confronted with the tough requirement of addressing a wide-range of standards and meeting a cost-effective performance/power trade-off. Increasing raw million instructions per second (MIPS) performance just by running at a higher frequency is not possible anymore since leakage is becoming a dominant factor with shrinking silicon geometries.
  • TPS40197 Reference Design
    PDF, 614 Kb, 档案已发布: Dec 17, 2008
    The TPS40197 reference design is a synchronous buck converter providing VID programmable output voltage from 0.9 V to 1.2 V at up to 7 A from a 12-V or 5-V bus (4.75 V ~ 13.2 V). The design uses the TPS40197 – a synchronous buck controller with 4-bit VID interface for Smart-Reflex™ DSPs.
  • C6474 (x2) Power Using Modules
    PDF, 107 Kb, 档案已发布: Sep 30, 2008
  • C6474 (x4) Power Using Modules
    PDF, 131 Kb, 档案已发布: Oct 1, 2008
  • TMS320C6455 to TMS320C6474 Migration Guide
    PDF, 311 Kb, 档案已发布: Oct 14, 2008
    The TMS320C6455 fixed-point digital signal processor (DSP) and the TMS320C6474 communications infrastructure DSP are two of Texas Instruments’ high-performance DSP processors, each offering high-speed DSP processing, large internal memories, a rich set of peripherals, and other support functions useful in a system environment.This application report describes device considerations for migrati
  • Tuning VCP2 and TCP2 Bit Error Rate Performance
    PDF, 293 Kb, 档案已发布: Feb 11, 2011
    In most customer applications, a high level of decoding bit error rate (BER) performance is required. Since Convolutional codes and Turbo codes are widely used in wireless communication systems, TI DSPs integrate two high-performance embedded coprocessors (enhanced Viterbi decoder coprocessor and enhanced Turbo decoder coprocessor) that significantly speed up channel-decoding operations on-chip.
  • Error Detection and Correction Mechanism of TMS320C64x+/C674x (Rev. A)
    PDF, 80 Kb, 修订版: A, 档案已发布: Jul 19, 2013
    This application report describes the error detection and correction mechanism of the C64x+/C674x megamodule L1P and L2 memories implemented on some devices. Depending on the type of application, these mechanisms are used to either provide diagnostic measures to detect faults in the memory that could lead to unacceptable risk for the user or to increase the availability of the system.
  • Multicore Programming Guide (Rev. B)
    PDF, 1.8 Mb, 修订版: B, 档案已发布: Aug 29, 2012
    As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
  • EDMA v2.0 to EDMA v3.0 (EDMA3) Migration Guide (Rev. A)
    PDF, 292 Kb, 修订版: A, 档案已发布: Aug 21, 2008
    This application report summarizes the key differences between the enhanced direct memory access (EDMA3) used on C64x+в„ў DSP devices and the EDMA2 used on TMS320C64xв„ў DSP devices, and provides guidance for migrating from EDMA2 to EDMA3.
  • TMS320C64x to TMS320C64x+ CPU Migration Guide (Rev. A)
    PDF, 310 Kb, 修订版: A, 档案已发布: Oct 20, 2005
    This document describes migration from the Texas Instruments TMS320C64xв„ў digital signal processor (DSP) to the TMS320C64x+в„ў DSP. The objective of this document is to indicate differences between the two cores and to briefly describe new features. Functionality in the devices that is identical is not included. For detailed information about either device, see the TMS320C64x/C64x+ DSP
  • Introduction to TMS320C6000 DSP Optimization
    PDF, 535 Kb, 档案已发布: Oct 6, 2011
    The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then

模型线

制造商分类

  • Semiconductors > Processors > Digital Signal Processors > C6000 DSP > Other C6000 DSP