Datasheet Texas Instruments TLV5639IDW — 数据表
| 制造商 | Texas Instruments |
| 系列 | TLV5639 |
| 零件号 | TLV5639IDW |
12位DAC，并行，电压输出，可编程内部参考，建立时间，Pwr消耗量，1通道20-SOIC -40至85
数据表
TLV5639C/39I; 2.7 V to 5.5 V Low Power 12-Bit DAC w/Internal Ref And Power Down datasheet
PDF, 899 Kb, 修订版: C, 档案已发布: Jan 20, 2004
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价格
状态
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
打包
| Pin | 20 |
| Package Type | DW |
| Industry STD Term | SOIC |
| JEDEC Code | R-PDSO-G |
| Package QTY | 25 |
| Carrier | TUBE |
| Device Marking | TLV5639I |
| Width (mm) | 7.5 |
| Length (mm) | 12.8 |
| Thickness (mm) | 2.35 |
| Pitch (mm) | 1.27 |
| Max Height (mm) | 2.65 |
| Mechanical Data | 下载 |
参数化
| Code to Code Glitch(Typ) | 5 nV-sec |
| DAC Architecture | String |
| DAC Channels | 1 |
| Gain Error(Max) | 0.3 %FSR |
| INL(Max) | 3 +/-LSB |
| Interface | Parallel |
| Offset Error(Max) | N/A % |
| Operating Temperature Range | -40 to 85,0 to 70 C |
| Output Range Max. | 5.1 mA/V |
| Output Type | Buffered Voltage |
| Package Group | SOIC |
| Package Size: mm2:W x L | 20SOIC: 132 mm2: 10.3 x 12.8(SOIC) PKG |
| Power Consumption(Typ) | 2.7 mW |
| Rating | Catalog |
| Reference: Type | Ext,Int |
| Resolution | 12 Bits |
| Sample / Update Rate | 0.286 MSPS |
| Settling Time | 1 µs |
| Special Features | N/A |
| Zero Code Error(Typ) | 14 mV |
生态计划
| RoHS | Compliant |
应用须知
- Interfacing the TLV5639 DAC to the TMS320C31 DSPPDF, 131 Kb, 档案已发布: Feb 12, 2001
This application report discusses the implementation of an interface between the TLV5639 DAC and the TMS320C31 DSP. The TLV5619-5639EVM is used to demonstrate the complete circuit implementation. This EVM is the evaluation module for the TLV5639 and the TLV561 DACs that take care of all necessary signal manipulation for the control signals of the DAC. The TLV5639 is a 12-bit DAC with a microproces
模型线
系列: TLV5639 (7)
制造商分类
- Semiconductors > Data Converters > Digital-to-Analog Converters (DACs) > Precision DACs (=<10MSPS)