Datasheet Texas Instruments TPS56221DQPR — 数据表
| 制造商 | Texas Instruments |
| 系列 | TPS56221 |
| 零件号 | TPS56221DQPR |
4.5V至14V输入，25A同步降压SWIFT™转换器22-LSON-CLIP -40至125
数据表
TPS56221 4.5-V to 14-V Input, High-Current, Synchronous Buck SWIFTв„ў Converter datasheet
PDF, 1.3 Mb, 修订版: D, 档案已发布: Feb 9, 2016
从文件中提取
价格
状态
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
打包
| Pin | 22 |
| Package Type | DQP |
| Industry STD Term | LSON-CLIP |
| JEDEC Code | R-PSSO-N |
| Package QTY | 2500 |
| Carrier | LARGE T&R |
| Device Marking | TPS56221 |
| Width (mm) | 5 |
| Length (mm) | 6 |
| Thickness (mm) | 1.5 |
| Pitch (mm) | .5 |
| Max Height (mm) | 1.5 |
| Mechanical Data | 下载 |
参数化
| Control Mode | Voltage Mode |
| Duty Cycle(Max) | 93 % |
| Iout(Max) | 25 A |
| Iq(Typ) | 2.5 mA |
| Operating Temperature Range | -40 to 125 C |
| Package Group | LSON-CLIP |
| Rating | Catalog |
| Regulated Outputs | 1 |
| Special Features | Enable,Light Load Efficiency,Pre-Bias Start-Up,Synchronous Rectification |
| Switching Frequency(Max) | 1000 kHz |
| Switching Frequency(Min) | 300 kHz |
| Type | Converter |
| Vin(Max) | 14 V |
| Vin(Min) | 4.5 V |
| Vout(Max) | 12 V |
| Vout(Min) | 0.6 V |
生态计划
| RoHS | Compliant |
| Pb Free | Yes |
设计套件和评估模块
- Evaluation Modules & Boards: TPS56221EVM-579
Evaluation Module for TPS56221 High Current (25A) Synchronous Step-Down SWIFTВ™ Converter
Lifecycle Status: Active (Recommended for new designs)
应用须知
- PowerStackв„ў Packaging Technology OverviewPDF, 515 Kb, 档案已发布: Jul 18, 2011
- Calculating EfficiencyPDF, 175 Kb, 档案已发布: Feb 19, 2010
This application report provides a step-by-step procedure for calculating buck converter efficiency and power dissipation at operating points not provided by the data sheet. - Demystifying Type II and Type III Compensators Using Op-Amp and OTA for DC/DC CoPDF, 782 Kb, 档案已发布: Jul 11, 2014
- Understanding Thermal Dissipation and Design of a HeatsinkPDF, 59 Kb, 档案已发布: May 4, 2011
Power dissipation performance must be well understood prior to integrating devices on a printed-circuit board (PCB) to ensure that any given device is operated within its defined temperature limits. When a device is running, it consumes electrical energy that is transformed into heat. Most of the heat is typically generated by switching devices like MOSFETs, ICs, etc. This application report discu - Semiconductor and IC Package Thermal Metrics (Rev. C)PDF, 201 Kb, 修订版: C, 档案已发布: Apr 19, 2016
模型线
系列: TPS56221 (2)
- TPS56221DQPR TPS56221DQPT
制造商分类
- Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)