Datasheet Texas Instruments TMX320C6727GDH — 数据表
制造商 | Texas Instruments |
系列 | TMS320C6727 |
零件号 | TMX320C6727GDH |
浮点数字信号处理器256-BGA
数据表
TMS320C6727, TMS320C6726, TMS320C6722 Floating-Point Digital Signal Processors datasheet
PDF, 1.1 Mb, 修订版: E, 档案已发布: Jan 5, 2007
从文件中提取
价格
状态
Lifecycle Status | Obsolete (Manufacturer has discontinued the production of the device) |
Manufacture's Sample Availability | No |
打包
Pin | 256 |
Package Type | GDH |
Industry STD Term | BGA |
JEDEC Code | S-PBGA-N |
Width (mm) | 17 |
Length (mm) | 17 |
Thickness (mm) | 1.41 |
Pitch (mm) | 1 |
Max Height (mm) | 2.02 |
Mechanical Data | 下载 |
参数化
Approx. Price (US$) | 21.24 | 1ku |
DSP | 1 C67x |
Rating | Catalog |
生态计划
RoHS | Not Compliant |
Pb Free | No |
设计套件和评估模块
- JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
XDS560v2 System Trace USB & Ethernet Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
XDS560v2 System Trace USB Debug Probe
Lifecycle Status: Active (Recommended for new designs)
应用须知
- Using ROM Contents on TMS320C672xPDF, 92 Kb, 档案已发布: Feb 5, 2008
This application report explains how to configure an application based on pure software libraries and routines and how to properly use the provided ROM contents for the TMS320C672x DSP generation of devices. Several software examples are provided, explaining the process in progressive steps. - C9230C100 TMS320C672x Floating-Point Digital Signal Processor ROM (Rev. C)PDF, 60 Kb, 修订版: C, 档案已发布: Sep 25, 2006
Describes the features of the C9230C100 TMS320C672x digital signal processor ROM. The system level patch, bootloader utilities and example code, can be downloaded from this link: http://www-s.ti.com/sc/psheets/sprc203/sprc203.zip. - How to Create Delay-based Audio Effects on a TMS320C6727 DSPPDF, 600 Kb, 档案已发布: Nov 1, 2005
TMS320C672x is a floating point device family from Texas Instruments that provides high quality audio performance at low prices. The price/performance ratio makes C672x well suited for numerous audio applications. This application note shows how to use C672x to efficiently create delay-based audio effects. The application note explains:How to leverage the data movement accelerator (dM - Using the TMS320C672x Bootloader (Rev. D)PDF, 456 Kb, 修订版: D, 档案已发布: Sep 10, 2009
This application report describes the design details of the TMS320C672x bootloader and describes a set of software utilities designed to facilitate formatting of application code for use with the bootloader.This application report contains a system level patch, the bootloader utilities and project code that can bedownloaded from this link: - TMS320C672x Power Consumption Summary (Rev. B)PDF, 55 Kb, 修订版: B, 档案已发布: Sep 22, 2006
This document discusses the power consumption of the Texas Instruments TMS320C672x digital signal processor (DSP). Power consumption on TMS320C67xв„ў devices is highly application-dependent. A spreadsheet is provided to model power consumption for the user’s application. To get good results from the spreadsheet, realistic usage parameters must be entered. The low-core voltage and other power d - TMS320C672x Hardware Designer's Resource Guide (Rev. A)PDF, 87 Kb, 修订版: A, 档案已发布: Sep 22, 2006
The DSP Hardware Designer's Resource Guide is organized by development flow and functional areas to make your design effort as seamless as possible. Topics covered include getting started, board design, system testing, and checklists to aid in your initial design and debug efforts. Each section includes pointers to valuable information including technical documentation, models, symbols, and refere - TMS320C6713 to TMS320C672x Migration GuidePDF, 182 Kb, 档案已发布: May 23, 2005
- Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
- Thermal Considerations for the DM64xx, DM64x, and C6000 DevicesPDF, 127 Kb, 档案已发布: May 20, 2007
As integrated circuit (IC) components become more complex, the challenge of producing an end product with superior thermal performance increases. Thermal performance is a system level concern, impacted by IC packaging as well as by printed circuit board (PCB) design. This application report addresses the thermal considerations for the TMS320DM64xx, TMS320DM64x, and TMS320C6000в„ў DSP devices. - Common Object File Format (COFF)PDF, 125 Kb, 档案已发布: Apr 15, 2009
模型线
系列: TMS320C6727 (3)
- TMS320C6727BZDH250 TMX320C6727GDH TMX320C6727ZDH
制造商分类
- Semiconductors > Processors > Digital Signal Processors > C6000 DSP > Other C6000 DSP