Datasheet Texas Instruments SN74CBTLV16212GR — 数据表

低压24位FET总线交换开关56-TSSOP -40至85

数据表

PDF, 369 Kb, 修订版: I, 档案已发布: Oct 10, 2003

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Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	No

Additional Features	Powered off protection
Bandwidth	200 MHz
Configuration	crosspoint/exchange
ESD HBM	2 kV
Input/Ouput Voltage(Max)	3.6 V
Input/Output Continuous Current(Max)	128 mA
Input/Output OFF-state Capacitance(Typ)	8 pF
Number of Channels	24
OFF-state leakage current(Max)	1 µA
ON-state leakage current(Max)	1 µA
Operating Temperature Range	-40 to 85 C
Package Group	TSSOP
Package Size: mm2:W x L	56TSSOP: 113 mm2: 8.1 x 14(TSSOP) PKG
Rating	Catalog
Ron(Max)	40 Ohms
Ron(Typ)	3 Ohms
Supply Current(Max)	10 uA
Supply Range	3.6 Max
VIH(Min)	2 V
VIL(Max)	0.8 V
Vdd(Max)	3.6 V
Vdd(Min)	2.3 V
Vss(Max)	N/A V
Vss(Min)	N/A V

RoHS

Compliant

Evaluation Modules & Boards: TMDXEVM368
TMS320DM36x Evaluation Module
Lifecycle Status: Active (Recommended for new designs)
- 下载
- 下载
Evaluation Modules & Boards: EVMX777BG-01-00-00
J6Entry, RSP and TDA2E-17 CPU Board Evaluation Module
Lifecycle Status: Active (Recommended for new designs)
Evaluation Modules & Boards: EVMX777G-01-20-00
J6Entry/RSP Infotainment (CPU+Display+JAMR3) Evaluation Module
Lifecycle Status: Active (Recommended for new designs)

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Bus FET Switch Solutions for Live Insertion Applications
PDF, 300 Kb, 档案已发布: Feb 7, 2003
In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ

系列: SN74CBTLV16212 (7)