SCBS006E -OCTOBER 1987 -REVISED APRIL 1994 SN54BCT244 . J OR W PACKAGE
SN74BCT244 . DB OR DW OR N PACKAGE
(TOP VIEW) State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
P-N-P Inputs Reduce DC Loading
ESD Protection Exceeds 2000 V
Per MIL-STD-883C, Method 3015
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, Ceramic Chip
Carriers (FK) and Flatpacks (W), and
Standard Plastic and Ceramic 300-mil DIPs
(J, N) 1OE
1A1
2Y4
1A2
2Y3
1A3 …
