Datasheet Texas Instruments MSP430F6747AIPEUR — 数据表
制造商 | Texas Instruments |
系列 | MSP430F6747A |
零件号 | MSP430F6747AIPEUR |
MSP430F6747A混合信号微控制器128-LQFP -40至85
数据表
MSP430F677xA, MSP430F676xA, MSP430F674xA Polyphase Metering SoCs datasheet
PDF, 2.9 Mb, 档案已发布: May 28, 2014
从文件中提取
价格
状态
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | No |
打包
Pin | 128 |
Package Type | PEU |
Industry STD Term | LQFP |
JEDEC Code | R-PQFP-G |
Package QTY | 750 |
Carrier | LARGE T&R |
Device Marking | F6747A |
Width (mm) | 14 |
Length (mm) | 20 |
Thickness (mm) | 1.4 |
Pitch (mm) | .5 |
Max Height (mm) | 1.6 |
Mechanical Data | 下载 |
参数化
ADC | ADC10 - 6ch,SigmaDelta24 - 4ch |
AES | AES128 |
Active Power | 346.8 uA/MHz |
Additional Features | LCD,Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA |
BSL | UART |
CPU | MSP430 |
DMA | 3 |
Featured | f6 |
Frequency | 25 MHz |
GPIO Pins | 90 |
I2C | 2 |
Max VCC | 3.6 |
Min VCC | 1.8 |
Multiplier | 32x32 |
Non-volatile Memory | 256 KB |
Operating Temperature Range | -40 to 85 C |
Package Group | LQFP |
Package Size: mm2:W x L | 100LQFP: 256 mm2: 16 x 16(LQFP) PKG |
RAM | 32 KB |
Rating | Catalog |
SPI | 6 |
Special I/O | N/A |
Standby Power | 2.9 LPM3-uA |
Timers - 16-bit | 4 |
UART | 4 |
Wakeup Time | 5 us |
生态计划
RoHS | Compliant |
设计套件和评估模块
- Development Kits: MSP-TS430PEU128
MSP-TS430PEU128 - 128-pin Target Development Board for MSP430F6x MCUs
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: EVM430-F6779
EVM430-F6779 - 3 Phase Electronic Watt-Hour EVM for Metering
Lifecycle Status: Active (Recommended for new designs) - Development Kits: MSP-FET430U128
128-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F6x MCUs
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: ENERGYTRACE
MSP EnergyTrace Technology
Lifecycle Status: Active (Recommended for new designs)
应用须知
- Differences Between MSP430F67xx and MSP430F67xxA DevicesPDF, 3.5 Mb, 档案已发布: Mar 30, 2015
This application report describes the enhancements of the MSP430F67xxA devices from the non-A MSP430F67xx devices. In the course of this application report, the MSP430F67xx errata that are fixed in the MSP430F67xxA and the additional features added to the MSP430F67xxA devices are discussed. In addition, metrology results are compared to further show that the changes implemented in the MSP430F67xxA - Designing With MSP430 and Segment LCDs (Rev. A)PDF, 2.1 Mb, 修订版: A, 档案已发布: Jul 20, 2015
Segment liquid crystal displays (LCDs) are needed to provide information to users in a wide variety of applications from smart meters to electronic shelf labels (ESL) to medical equipment. Several MSP430в„ў microcontroller families include built-in low-power LCD driver circuitry that allows the MSP430 MCU to directly control the segmented LCD glass. This application note helps explain how segmented - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl - MSP Code Protection FeaturesPDF, 752 Kb, 档案已发布: Dec 7, 2015
MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur - ESD Diode Current SpecificationPDF, 520 Kb, 档案已发布: Dec 7, 2015
This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.
模型线
系列: MSP430F6747A (4)
- MSP430F6747AIPEU MSP430F6747AIPEUR MSP430F6747AIPZ MSP430F6747AIPZR
制造商分类
- Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430F5x/6x