Datasheet Texas Instruments TPS51631RSMT — 数据表

制造商	Texas Instruments
系列	TPS51631
零件号	TPS51631RSMT

适用于VR12.5 CPU 32-VQFN -40至105的3相DCAP +降压控制器

数据表

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PDF, 744 Kb, 修订版: B, 档案已发布: Aug 22, 2013

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For a detailed datasheet and other design support tools please contact
IMVP@list.ti.com PACKAGE OPTION ADDENDUM www.ti.com 15-Jan-2016 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) TPS51631RSMR ACTIVE VQFN RSM 32 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 105 TPS
51631 TPS51631RSMT ACTIVE VQFN RSM 32 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 105 TPS
51631 (1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan -The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) -please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. …

价格

状态

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	Yes

打包

Pin	32	32
Package Type	RSM	RSM
Industry STD Term	VQFN	VQFN
JEDEC Code	S-PQFP-N	S-PQFP-N
Package QTY	250	250
Carrier	SMALL T&R	SMALL T&R
Device Marking	TPS	51631
Width (mm)	4	4
Length (mm)	4	4
Thickness (mm)	.9	.9
Pitch (mm)	.4	.4
Max Height (mm)	1	1
Mechanical Data	下载	下载

参数化

Iout(Max)	95 A
Iq(Typ)	0.5 mA
Number of Phases	3
Operating Temperature Range	-40 to 105 C
Package Group	VQFN
Package Size: mm2:W x L	32VQFN: 16 mm2: 4 x 4(VQFN) PKG
Platform	VR12.5
Rating	Catalog
Regulated Outputs	1
Special Features	Power Good,SVID
Switching Frequency(Max)	1000 kHz
Switching Frequency(Min)	300 kHz
Type	V-Core Controllers
Vin(Max)	28 V
Vin(Min)	4.5 V
Vout(Max)	2.3 V
Vout(Min)	0.5 V
Vref Accuracy(Typ)	0.5 %

生态计划

RoHS

Compliant

应用须知

下载
Multiphase Buck Design from Start to Finish, Part 1
PDF, 3.7 Mb, 档案已发布: Apr 25, 2017

模型线

系列: TPS51631 (2)

TPS51631RSMR TPS51631RSMT

制造商分类

Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Processor V-Core Buck Controller