Datasheet Texas Instruments MSP430F5227IRGCR — 数据表
| 制造商 | Texas Instruments |
| 系列 | MSP430F5227 |
| 零件号 | MSP430F5227IRGCR |
超低功耗1.8V分离轨I / O 64-VQFN -40至85
数据表
MSP430F522x, MSP430F521x Mixed-Signal Microcontrollers datasheet
PDF, 2.1 Mb, 修订版: G, 档案已发布: Jun 28, 2016
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价格
状态
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
打包
| Pin | 64 |
| Package Type | RGC |
| Industry STD Term | VQFN |
| JEDEC Code | S-PQFP-N |
| Package QTY | 2000 |
| Carrier | LARGE T&R |
| Device Marking | F5227 |
| Width (mm) | 9 |
| Length (mm) | 9 |
| Thickness (mm) | .88 |
| Pitch (mm) | .5 |
| Max Height (mm) | 1 |
| Mechanical Data | 下载 |
参数化
| ADC | ADC10 - 10ch |
| AES | N/A |
| Active Power | 404 uA/MHz |
| Additional Features | Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA |
| BSL | UART |
| CPU | MSP430 |
| Comparators | 8 |
| DMA | 3 |
| Featured | f5 |
| Frequency | 25 MHz |
| GPIO Pins | 53 |
| I2C | 2 |
| Max VCC | 3.6 |
| Min VCC | 1.8 |
| Multiplier | 32x32 |
| Non-volatile Memory | 64 KB |
| Operating Temperature Range | -40 to 85 C |
| Package Group | VQFN |
| Package Size: mm2:W x L | 64VQFN: 81 mm2: 9 x 9(VQFN) PKG |
| RAM | 8 KB |
| Rating | Catalog |
| SPI | 4 |
| Special I/O | 1.8V I/O |
| Standby Power | 2.5 LPM3-uA |
| Timers - 16-bit | 4 |
| UART | 2 |
| Wakeup Time | 3.5 us |
生态计划
| RoHS | Compliant |
设计套件和评估模块
- Evaluation Modules & Boards: MSP-TS430RGC64C
MSP-TS430RGC64C - 64-pin Target Development Board for MSP430F5x MCUs
Lifecycle Status: Active (Recommended for new designs) - Development Kits: MSP-FET430U64C
64-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F5x MCUs
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: ENERGYTRACE
MSP EnergyTrace Technology
Lifecycle Status: Active (Recommended for new designs)
应用须知
- Designing with MSP430F522x and MSP430F521x DevicesPDF, 72 Kb, 档案已发布: Nov 30, 2012
The MSP430F522x and MSP430F521x devices support a split supply I/O system that is essential in systems in which the MCU is required to interface with external devices (such as sensors or other processors) that operate at different voltage level compared to the MCU device supply. Additionally, the split supply input voltage range of the F522x and F521x devices starts as low as 1.62 V (see the devic - Using the MSP430 Timer_D Module in Hi-Resolution ModePDF, 870 Kb, 档案已发布: Oct 2, 2013
This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration - Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)PDF, 151 Kb, 修订版: D, 档案已发布: Nov 3, 2016
This application report helps enable easy migration from MSP430F5xx and MSP430F6xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight differences between the - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl - MSP Code Protection FeaturesPDF, 752 Kb, 档案已发布: Dec 7, 2015
MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur - Design Considerations When Using the MSP430 Graphics LibraryPDF, 475 Kb, 档案已发布: Oct 5, 2012
LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This - ESD Diode Current SpecificationPDF, 520 Kb, 档案已发布: Dec 7, 2015
This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.
模型线
系列: MSP430F5227 (4)
- MSP430F5227IRGCR MSP430F5227IYFFR MSP430F5227IZQE MSP430F5227IZQER
制造商分类
- Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430F5x/6x