PDF, 1.1 Mb, 修订版: A, 档案已发布: Jul 26, 2016
TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
PDF, 253 Kb, 档案已发布: May 1, 1996
PDF, 40 Kb, 档案已发布: Jul 20, 1999
Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency.
PDF, 769 Kb, 档案已发布: Sep 7, 2001
Texas Instruments offers a wide variety of electronic switches (digital analog bilateral bilateral analog) in a variety of families including CBT CBTLV HC LV and LVC. Depending on the application the right solution may be an analog switch that passes digital signals or vice versa. This application report summarizes the various switching technologies and provides considerations for choosi
PDF, 115 Kb, 档案已发布: Dec 1, 1997
This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
PDF, 380 Kb, 档案已发布: Aug 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
PDF, 35 Kb, 修订版: B, 档案已发布: Mar 1, 1997
The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not
PDF, 32 Kb, 修订版: A, 档案已发布: Apr 3, 1998
PDF, 300 Kb, 档案已发布: Feb 7, 2003
In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
PDF, 359 Kb, 档案已发布: Nov 1, 2002
Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond
PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
PDF, 337 Kb, 档案已发布: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
PDF, 313 Kb, 修订版: A, 档案已发布: Jun 22, 2004
Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
PDF, 260 Kb, 修订版: D, 档案已发布: Jun 23, 2016
