Data sheet acquired from Harris Semiconductor
SCHS052B – Revised June 2003 The CD4067B and CD4097B types are supplied
in 24-lead hermetic dual-in-line ceramic
packages (F3A suffix), 24-lead dual-in-line
plastic
packages
(E
suffix),
24-lead
small-outline packages (M, M96, and NSR
suffixes), and 24-lead thin shrink small-outline
packages (P and PWR suffixes). Copyright В© 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2015 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) CD4067BF ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4067BF CD4067BF3A ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4067BF3A CD4067BM ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM CD4067BM96 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CD4067BM CD4067BM96E4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM CD4067BM96G4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM CD4067BME4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM CD4067BPW ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM067B CD4067BPWG4 ACTIVE TSSOP PW 24 60 Green (RoHS …
