Datasheet Texas Instruments 74LVT162245ADGGRE4 — 数据表
制造商 | Texas Instruments |
系列 | SN74LVT162245A |
零件号 | 74LVT162245ADGGRE4 |
具有三态输出的3.3V ABT 16位总线收发器48-TSSOP -40至85
数据表
价格
状态
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | No |
打包
Pin | 48 |
Package Type | DGG |
Industry STD Term | TSSOP |
JEDEC Code | R-PDSO-G |
Package QTY | 2000 |
Carrier | LARGE T&R |
Device Marking | LVT162245A |
Width (mm) | 6.1 |
Length (mm) | 12.5 |
Thickness (mm) | 1.15 |
Pitch (mm) | .5 |
Max Height (mm) | 1.2 |
Mechanical Data | 下载 |
参数化
Bits | 16 |
F @ Nom Voltage(Max) | 160 Mhz |
ICC @ Nom Voltage(Max) | 5 mA |
Operating Temperature Range | -40 to 85 C |
Output Drive (IOL/IOH)(Max) | -32/64 mA |
Package Group | TSSOP |
Package Size: mm2:W x L | 48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) PKG |
Rating | Catalog |
Schmitt Trigger | No |
Technology Family | LVT |
VCC(Max) | 3.6 V |
VCC(Min) | 2.7 V |
Voltage(Nom) | 3.3 V |
tpd @ Nom Voltage(Max) | 3.7 ns |
生态计划
RoHS | Compliant |
应用须知
- LVT Family Characteristics (Rev. A)PDF, 98 Kb, 修订版: A, 档案已发布: Mar 1, 1998
To address the need for a complete low-voltage interface solution, Texas Instruments has developed a new generation of logic devices capable of mixed-mode operation. The LVT series relies on a state-of-the-art submicron BiCMOS process to provide up to a 90% reduction in static power dissipation over ABT. LVT devices solve the system need for a transparent seam between the low-voltage and 5-V secti - LVT-to-LVTH ConversionPDF, 84 Kb, 档案已发布: Dec 8, 1998
Original LVT devices that have bus hold have been redesigned to add the High-Impedance State During Power Up and Power Down feature. Additional devices with and without bus hold have been added to the LVT product line. Design guidelines and issues related to the bus-hold features, switching characteristics, and timing requirements are discussed. - 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa - Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi - Understanding Advanced Bus-Interface Products Design GuidePDF, 253 Kb, 档案已发布: May 1, 1996
- Power-Up 3-State (PU3S) Circuits in TI Standard Logic DevicesPDF, 209 Kb, 档案已发布: May 10, 2002
Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features - Implications of Slow or Floating CMOS Inputs (Rev. D)PDF, 260 Kb, 修订版: D, 档案已发布: Jun 23, 2016
- Live InsertionPDF, 150 Kb, 档案已发布: Oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Mb, 档案已发布: Oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
模型线
系列: SN74LVT162245A (5)
- 74LVT162245ADGGRE4 SN74LVT162245ADGGR SN74LVT162245ADL SN74LVT162245ADLR SN74LVT162245AGQLR
制造商分类
- Semiconductors > Logic > Buffer/Driver/Transceiver > Standard Transceiver