Data sheet acquired from Harris Semiconductor
SCHS021D – Revised September 2003 The CD4011B, CD4012B, and CD4023B types
are supplied in 14-lead hermetic dual-in-line
ceramic packages (F3A suffix), 14-lead
dual-in-line plastic packages (E suffix), 14-lead
small-outline packages (M, MT, M96, and NSR
suffixes), and 14-lead thin shrink small-outline
packages (PWR suffix). The CD4011B and
CD4023B types also are supplied in 14-lead thin
shrink small-outline packages (PW suffix). Copyright В© 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) CD4011BE ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4011BE CD4011BEE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4011BE CD4011BF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD4011BF CD4011BF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD4011BF3A CD4011BM ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4011BM CD4011BM96 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4011BM CD4011BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4011BM CD4011BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4011BM CD4011BME4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4011BM CD4011BMT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4011BM CD4011BNSR ACTIVE SO NS 14 2000 Green (RoHS …