Data sheet acquired from Harris Semiconductor
SCHS016C – Revised September 2003 The CD4001UB types are supplied in
14-lead hermetic dual-in-line ceramic
packages (F3A suffix), 14-lead dual-in-line
plastic packages (E suffix), 14-lead
small-outline packages (M, MT, M96, and
NSR suffixes), and 14-lead thin shrink
small-outline packages (PW and PWR
suffixes). Copyright В© 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2014 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) CD4001UBE ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4001UBE CD4001UBEE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4001UBE CD4001UBF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD4001UBF CD4001UBF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD4001UBF3A CD4001UBM ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001UBM CD4001UBM96 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001UBM CD4001UBME4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001UBM CD4001UBPW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM001UB CD4001UBPWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM001UB CD4001UBPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM001UB (1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. …