Datasheet Texas Instruments TPA701DGNG4 — 数据表
制造商 | Texas Instruments |
系列 | TPA701 |
零件号 | TPA701DGNG4 |
700mW单声道,AB类音频放大器8-MSOP-PowerPAD -40至85
数据表
价格
状态
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | No |
打包
Pin | 8 |
Package Type | DGN |
Industry STD Term | HVSSOP |
JEDEC Code | S-PDSO-G |
Package QTY | 80 |
Carrier | TUBE |
Device Marking | ABA |
Width (mm) | 3 |
Length (mm) | 3 |
Thickness (mm) | 1.02 |
Pitch (mm) | .65 |
Max Height (mm) | 1.1 |
Mechanical Data | 下载 |
参数化
Analog Supply (V) | 5.5 Min |
Architecture | Class AB |
Audio Input Type | Analog Input |
Control Interface | Hardware |
Iq per channel(Typ) | 1.25 mA |
Iq(Max) | 2.5 mA |
Iq(Typ) | 1.25 mA |
Load(Min) | 8 ohms |
Operating Temperature Range | -40 to 85 C |
Output Power | 0.7 W |
PSRR | 85 dB |
Package Group | MSOP-PowerPAD |
Package Size: mm2:W x L | 8MSOP-PowerPAD: 15 mm2: 4.9 x 3(MSOP-PowerPAD) PKG |
Pin/Package | 8MSOP-PowerPAD, 8SOIC |
Rating | Catalog |
Shutdown Current (ISD) | 0.0015 uA |
Speaker Channels | Mono Max |
THD + N @ 1 kHz | 0.5 % |
生态计划
RoHS | Compliant |
应用须知
- PowerPAD Thermally Enhanced Package (Rev. H)PDF, 983 Kb, 修订版: H, 档案已发布: Jul 6, 2018
模型线
系列: TPA701 (8)
- TPA701D TPA701DG4 TPA701DGN TPA701DGNG4 TPA701DGNR TPA701DR TPA701DRG4 TPA701EVM
制造商分类
- Semiconductors > Audio > Low-Power Audio Amplifiers (<10W) > Speaker Amplifier Class AB/Class D