Datasheet Texas Instruments MSP430F6459IPZ — 数据表

制造商Texas Instruments
系列MSP430F6459
零件号MSP430F6459IPZ
Datasheet Texas Instruments MSP430F6459IPZ

MSP430F64xx混合信号微控制器100-LQFP -40至85

数据表

MSP430F665x, MSP430F645x, MSP430F565x, MSP430F535x Mixed Signal Microcontroller datasheet
PDF, 1.9 Mb, 修订版: C, 档案已发布: Oct 21, 2013
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin100
Package TypePZ
Industry STD TermLQFP
JEDEC CodeS-PQFP-G
Package QTY90
CarrierJEDEC TRAY (10+1)
Device MarkingF6459
Width (mm)14
Length (mm)14
Thickness (mm)1.4
Pitch (mm).5
Max Height (mm)1.6
Mechanical Data下载

参数化

ADCADC12 - 12ch
AESN/A
Active Power370 uA/MHz
Additional FeaturesLCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA
BSLUART
CPUMSP430
Comparators12
DMA6
Featuredf6
Frequency20 MHz
GPIO Pins74
I2C3
Max VCC3.6
Min VCC1.8
Multiplier32x32
Non-volatile Memory512 KB
Operating Temperature Range-40 to 85 C
Package GroupLQFP
Package Size: mm2:W x L100LQFP: 256 mm2: 16 x 16(LQFP) PKG
RAM66 KB
RatingCatalog
SPI6
Special I/ON/A
Standby Power2.6 LPM3-uA
Timers - 16-bit4
UART3
Wakeup Time3 us

生态计划

RoHSCompliant

设计套件和评估模块

  • Evaluation Modules & Boards: MSP-TS430PZ100C
    MSP-TS430PZ100C - 100-pin Target Development Board for MSP430F5x and MSP430F6x MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: MSP-EXP430F5529LP
    MSP430F5529 USB LaunchPad Evaluation Kit
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: MSP-FET430U128
    128-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F6x MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: ENERGYTRACE
    MSP EnergyTrace Technology
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)
    PDF, 135 Kb, 修订版: B, 档案已发布: Jun 4, 2015
    Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th
  • MSP430 Embedded Application Binary Interface
    PDF, 596 Kb, 档案已发布: May 16, 2012
    This document is a specification for the ELF-based Embedded Application Binary Interface (EABI) for the MSP430 family of processors from Texas Instruments. The EABI defines the low-level interface between programs, program components, and the execution environment, including the operating system if one is present. Components of the EABI include calling conventions, data layout and addressing conve
  • Designing With MSP430 and Segment LCDs (Rev. A)
    PDF, 2.1 Mb, 修订版: A, 档案已发布: Jul 20, 2015
    Segment liquid crystal displays (LCDs) are needed to provide information to users in a wide variety of applications from smart meters to electronic shelf labels (ESL) to medical equipment. Several MSP430в„ў microcontroller families include built-in low-power LCD driver circuitry that allows the MSP430 MCU to directly control the segmented LCD glass. This application note helps explain how segmented
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • MSP Code Protection Features
    PDF, 752 Kb, 档案已发布: Dec 7, 2015
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
  • ESD Diode Current Specification
    PDF, 520 Kb, 档案已发布: Dec 7, 2015
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

模型线

制造商分类

  • Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430F5x/6x