Datasheet Texas Instruments MSP430FR5888IRGCT — 数据表

制造商Texas Instruments
系列MSP430FR5888
零件号MSP430FR5888IRGCT
Datasheet Texas Instruments MSP430FR5888IRGCT

MSP430FR5888 16 MHz ULP微处理器,具有96 KB FRAM,2 KB SRAM,40 IO,ADC12,扫描IF 64-VQFN -40至85

数据表

MSP430FR688x(1), MSP430FR588x(1) Mixed-Signal Microcontrollers datasheet
PDF, 2.6 Mb, 修订版: B, 档案已发布: Mar 9, 2017
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin64
Package TypeRGC
Industry STD TermVQFN
JEDEC CodeS-PQFP-N
Package QTY250
CarrierSMALL T&R
Device MarkingFR5888
Width (mm)9
Length (mm)9
Thickness (mm).88
Pitch (mm).5
Max Height (mm)1
Mechanical Data下载

参数化

ADCADC12 - 12ch
AESN/A
Active Power101.25 uA/MHz
Additional FeaturesReal-Time Clock,Watchdog,Scan Interface,Temp Sensor,Brown Out Reset,IrDA
BSLUART
CPUMSP430
Comparators12
DMA3
Featuredfr5
Frequency16 MHz
GPIO Pins48
I2C2
Max VCC3.6
Min VCC1.8
Multiplier32x32
Non-volatile Memory96 KB
Operating Temperature Range-40 to 85 C
Package GroupVQFN
Package Size: mm2:W x L64VQFN: 81 mm2: 9 x 9(VQFN) PKG
RAM2 KB
RatingCatalog
SPI4
Security EnablerCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection
Special I/ON/A
Standby Power0.9 LPM3-uA
Timers - 16-bit5
UART2
Wakeup Time7 us

生态计划

RoHSCompliant

设计套件和评估模块

  • Evaluation Modules & Boards: MSP-FET430U100D
    100-pin Target Development Board and MSP-FET Programmer Bundle for MSP430FRxx FRAM MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: MSP-TS430PZ100D
    MSP-TS430PZ100D- 100-pin Target Development Board for MSP430FRxx FRAM MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: MSP-FET430U48C
    48-pin Target Development Board and MSP-FET Programmer Bundle for MSP430FRxx FRAM MCUs
    Lifecycle Status: Obsolete (Manufacturer has discontinued the production of the device)
  • Evaluation Modules & Boards: MSP-TS430RGZ48C
    MSP-TS430RGZ48C - 48-pin Target Development Board for MSP430FRxx FRAM MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: ENERGYTRACE
    MSP EnergyTrace Technology
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • Method to Select the Value of LC Sensor for MSP430 Extended Scan Interface (ESI)
    PDF, 374 Kb, 档案已发布: Aug 28, 2014
    This document describes a method that can be used to select an LC sensor for use with the MSP430в„ў Extended Scan Interface (ESI).
  • LC Sensor Rotation Detection With MSP430 Extended Scan Interface (ESI)
    PDF, 2.2 Mb, 档案已发布: Aug 28, 2014
    This application report describes the implementation of a flow meter using the Texas Instruments MSP430FR6989 microcontroller with the Extended Scan Interface (ESI) module. This module can provide a contactless sensing approach to detecting a rotating disc. The number of rotations of the disc indicates the volume flow of gas or water and can be used to calculate the fee for the user. This applicat
  • Adjustment of ESIOSC Oscillator Frequency (Rev. A)
    PDF, 192 Kb, 修订版: A, 档案已发布: Jan 30, 2015
    The MSP430FR698x Extended Scan Interface (ESI) uses two clock sources. These clocks are ACLK and a high-frequency clock generated by the ESI oscillator, ESIOSC. ESIOSC is realized as an RC-oscillator and shows a temperature and voltage dependency. However, a hardware-supported measurement of ESIOSC frequency and adjustment by software allows compensating for the frequency drift. This application r
  • Migrating From MSP430FW42x Scan Interface to MSP430FR6x8x/FR5x8x ESI (Rev. A)
    PDF, 95 Kb, 修订版: A, 档案已发布: Feb 6, 2015
    The purpose of this application report is to facilitate the migration of designs based on the MSP430FW42x Scan Interface (SIF) to the MSP430FR5xx/FR6xx Extended Scan Interface (ESI). This document describes the main differences between the two peripheral modules and provides migration solutions covering both software and hardware aspects.
  • Getting Started With EEMBC ULPBench on MSP-EXP430FR5969 (Rev. A)
    PDF, 381 Kb, 修订版: A, 档案已发布: Jan 29, 2015
    This is a getting started guide for obtaining the ULPMarkв„ў-CP score using the Embedded Microprocessor Benchmark Consortium (EEMBC) ULPBench and EnergyMonitor with the MSP430FR5969 microcontroller (MCU). This document uses the MSP-EXP430FR5969 LaunchPad development kit as the target evaluation module (EVM) for performing the benchmark.
  • Migrating From MSP430F4xx Family to MSP430FR58xx/FR59xx/FR68xx/FR69xx Family (Rev. B)
    PDF, 183 Kb, 修订版: B, 档案已发布: Nov 3, 2016
    This application report enables easy migration from MSP430F4xx flash-based MCUs to the MSP430FR58xx/59xx/68xx/69xx family of FRAM-based MCUs. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR58xx/FR59xx/68xx/69xx devices, see the MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, and MSP430FR69xx Family User's Guide.
  • MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology
    PDF, 4.0 Mb, 档案已发布: Jun 9, 2014
    MSP430 microcontrollers are designed specifically for ultra-low-power applications. Features such as multiple low-power modes, instant wakeup, intelligent autonomous peripherals, and much more to enable such ultra-low-power capabilities. Texas Instruments provides valuable tools to help the programmer fully use these benefits and optimize power consumption of the target application. This app
  • Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A)
    PDF, 137 Kb, 修订版: A, 档案已发布: Mar 30, 2016
    Designing an application with the analog-to-digital converter (ADC) requires several considerations to optimize for power and performance. This application report discusses the basics of how you would analyze a data sheet and user's guide to design your application. It goes into the fundamentals of how to optimize your design based on the external requirements and available ADC configurations. The
  • MSP430 FRAM Technology – How To and Best Practices
    PDF, 326 Kb, 档案已发布: Jun 23, 2014
    FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
  • MSP430 FRAM Quality and Reliability (Rev. A)
    PDF, 295 Kb, 修订版: A, 档案已发布: May 1, 2014
    FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
  • Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
    PDF, 151 Kb, 修订版: D, 档案已发布: Nov 3, 2016
    This application report helps enable easy migration from MSP430F5xx and MSP430F6xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight differences between the
  • Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)
    PDF, 179 Kb, 修订版: E, 档案已发布: Nov 3, 2016
    This application report enables easy migration from MSP430F2xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx family of FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight key differences between the two f
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl

模型线

制造商分类

  • Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430FRxx FRAM