Datasheet Texas Instruments 74LVC1G126DBVTE4 — 数据表

制造商Texas Instruments
系列SN74LVC1G126
零件号74LVC1G126DBVTE4
Datasheet Texas Instruments 74LVC1G126DBVTE4

具有三态输出的单总线缓冲门5-SOT-23 -40至125

数据表

SN74LVC1G126 Single Bus Buffer Gate With 3-State Output datasheet
PDF, 1.4 Mb, 修订版: R, 档案已发布: Jan 25, 2015
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin5
Package TypeDBV
Industry STD TermSOT-23
JEDEC CodeR-PDSO-G
Package QTY250
CarrierSMALL T&R
Device MarkingC26F
Width (mm)1.6
Length (mm)2.9
Thickness (mm)1.2
Pitch (mm).95
Max Height (mm)1.45
Mechanical Data下载

参数化

3-State OutputYes
Bits1
F @ Nom Voltage(Max)150 Mhz
Gate TypeBUFFER
ICC @ Nom Voltage(Max)0.01 mA
LogicTrue
Operating Temperature Range-40 to 125,-40 to 85 C
Output Drive (IOL/IOH)(Max)32/-32 mA
Package GroupSOT-23
Package Size: mm2:W x L5SOT-23: 8 mm2: 2.8 x 2.9(SOT-23) PKG
RatingCatalog
Schmitt TriggerNo
Special FeaturesIoff,down translation to Vcc,low power,3-state
Sub-FamilyNon-Inverting Buffer/Driver
Technology FamilyLVC
VCC(Max)5.5 V
VCC(Min)1.65 V
Voltage(Nom)1.8,2.5,3.3,5 V
tpd @ Nom Voltage(Max)8,5.5,4.5,4 ns

生态计划

RoHSCompliant

设计套件和评估模块

  • Evaluation Modules & Boards: TMDXEVM388
    DM388 DaVinci Digital Media Processor Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: EVMX777G-01-20-00
    J6Entry/RSP Infotainment (CPU+Display+JAMR3) Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: EVMX777BG-01-00-00
    J6Entry, RSP and TDA2E-17 CPU Board Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: EV2300
    USB-Based PC Interface Board for Battery Fuel (Gas) Gauge Evaluation
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • LVC Characterization Information
    PDF, 114 Kb, 档案已发布: Dec 1, 1996
    This document provides characterization information about low-voltage logic (LVL) that operates from a 3.3-V power supply. It addresses the issues of interfacing to 5-V logic ac performance power considerations input and output characteristics and signal integrity for this family of devices.
  • Use of the CMOS Unbuffered Inverter in Oscillator Circuits
    PDF, 796 Kb, 档案已发布: Nov 6, 2003
    CMOS devices have a high input impedance high gain and high bandwidth. These characteristics are similar to ideal amplifier characteristics and hence a CMOS buffer or inverter can be used in an oscillator circuit in conjunction with other passive components. Now CMOS oscillator circuits are widely used in high-speed applications because they are economical easy to use and take significantly
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, 档案已发布: May 1, 1996
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, 档案已发布: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
  • How to Select Little Logic (Rev. A)
    PDF, 1.1 Mb, 修订版: A, 档案已发布: Jul 26, 2016
    TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Kb, 档案已发布: Dec 1, 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • Texas Instruments Little Logic Application Report
    PDF, 359 Kb, 档案已发布: Nov 1, 2002
    Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, 修订版: A, 档案已发布: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, 修订版: D, 档案已发布: Jun 23, 2016
  • Live Insertion
    PDF, 150 Kb, 档案已发布: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, 修订版: B, 档案已发布: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, 档案已发布: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Selecting the Right Texas Instruments Signal Switch
    PDF, 769 Kb, 档案已发布: Sep 7, 2001
    Texas Instruments offers a wide variety of electronic switches (digital analog bilateral bilateral analog) in a variety of families including CBT CBTLV HC LV and LVC. Depending on the application the right solution may be an analog switch that passes digital signals or vice versa. This application report summarizes the various switching technologies and provides considerations for choosi

模型线

制造商分类

  • Semiconductors > Logic > Little Logic