Datasheet Texas Instruments X66AK2G02ZBB60 — 数据表

制造商	Texas Instruments
系列	66AK2G02
零件号	X66AK2G02ZBB60

数据表

价格

状态

打包

参数化

生态计划

设计套件和评估模块

• Daughter Cards: AUDK2G
  66AK2Gx (K2G) Audio Daughter Card
  Lifecycle Status: Active (Recommended for new designs)
  
  • 下载
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• Evaluation Modules & Boards: K2GICE
  66AK2Gx (K2G) Industrial Communications Engine (ICE)
  Lifecycle Status: Active (Recommended for new designs)
  
  • 下载
• Evaluation Modules & Boards: EVMK2G
  66AK2Gx (K2G) Evaluation Module
  Lifecycle Status: Active (Recommended for new designs)
  
  • 下载
  • 下载
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应用须知

• 下载
  66AK2G0x General-Purpose EVM Power Distribution Network Analysis
  PDF, 584 Kb, 档案已发布: Nov 16, 2016
  The purpose of this application report is to present the flow, the environment settings and methodology used for a performance analysis of critical power nets of a platform using the 66AK2G0x System-on-Chip (SoC) application processor.
• 下载
  66AK2G02 Schematic Checklist
  PDF, 95 Kb, 档案已发布: Sep 16, 2016
• 下载
  66AK2G02 Power Estimation Tool
  PDF, 27 Kb, 档案已发布: Jun 15, 2017
  This power estimation spreadsheet provides power consumption estimates based on measured and simulated data; they are provided “as is” and are not ensured within a specified precision. Power consumption depends on electrical parameters, silicon process variations, environmental conditions, and use cases running on the processor during operation. Actual power consumption should be verified in the r
• 下载
  Hardware Design Guide for KeyStone II Devices
  PDF, 1.8 Mb, 档案已发布: Mar 24, 2014
• 下载
  SERDES Link Commissioning on KeyStone I and II Devices
  PDF, 138 Kb, 档案已发布: Apr 13, 2016
  The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
• 下载
  DDR3 Design Requirements for KeyStone Devices (Rev. B)
  PDF, 582 Kb, 修订版: B, 档案已发布: Jun 5, 2014
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  Processor SDK RTOS Audio Benchmark Starter Kit
  PDF, 530 Kb, 档案已发布: Apr 12, 2017
  The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device
• 下载
  PRU-ICSS Feature Comparison
  PDF, 29 Kb, 档案已发布: Jun 5, 2017
  This application report documents the feature differences between the PRU subsystems available on different TI processors.
• 下载
  TI DSP Benchmarking
  PDF, 62 Kb, 档案已发布: Jan 13, 2016
  This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
• 下载
  High-Speed Interface Layout Guidelines (Rev. G)
  PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
  As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

制造商分类

• Semiconductors > Processors > Digital Signal Processors > C6000 DSP + ARM Processors > 66AK2x