Datasheet Texas Instruments TMP007AIYZFR — 数据表

带有WCSP封装的集成数学引擎的红外热电堆非接触式温度传感器8-DSBGA -40至125

数据表

PDF, 1.3 Mb, 修订版: C, 档案已发布: Jul 28, 2015

Lifecycle Status	NRND (Not recommended for new designs)
Manufacture's Sample Availability	No

RoHS

Compliant

Evaluation Modules & Boards: TMP007EVM
TMP007 Evaluation Module for Infrared Thermopile Sensor with Integrated Math Engine
Lifecycle Status: Active (Recommended for new designs)
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Evaluation Modules & Boards: TMP007EASYCALEVM
TMP007EasyCalEVM
Lifecycle Status: Active (Recommended for new designs)
- 下载
Evaluation Modules & Boards: CC3200STK-WIFIMK
SimpleLinkВ™ Wi-FiВ® CC3200 SensorTag
Lifecycle Status: Active (Recommended for new designs)
- 下载
- 下载
Evaluation Modules & Boards: BOOSTXL-SENSORS
Sensors BoosterPack Plug-In Module
Lifecycle Status: Active (Recommended for new designs)
- 下载
- 下载
Development Kits: CC2650STK
SimpleLinkВ™ Bluetooth low energy/Multi-standard SensorTag
Lifecycle Status: Active (Recommended for new designs)

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TMP006 and TMP007: Through-Hole Mounting Method
PDF, 1.8 Mb, 档案已发布: Sep 1, 2016
This applicationnotedescribesa new methodof mountingTMP007WCSPdie on the printed-circuitboard(PCB).The advantagesof the new methodare describedand mountingrecommendationsare provided.All of the followingrecommendationsand conclusionsare also true for TMP006parts.
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AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)
PDF, 13.7 Mb, 修订版: AG, 档案已发布: Aug 12, 2015
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Understanding the I2C Bus
PDF, 124 Kb, 档案已发布: Jun 30, 2015

系列: TMP007 (2)

Semiconductors > Sensing Products > Temperature Sensors > Cable & Probe Temperature Sensors