Datasheet Texas Instruments TPA701DG4 — 数据表
| 制造商 | Texas Instruments |
| 系列 | TPA701 |
| 零件号 | TPA701DG4 |
700mW单声道，AB类音频放大器8-SOIC -40至85
数据表
价格
状态
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
打包
| Pin | 8 |
| Package Type | D |
| Industry STD Term | SOIC |
| JEDEC Code | R-PDSO-G |
| Package QTY | 75 |
| Carrier | TUBE |
| Device Marking | 701 |
| Width (mm) | 3.91 |
| Length (mm) | 4.9 |
| Thickness (mm) | 1.58 |
| Pitch (mm) | 1.27 |
| Max Height (mm) | 1.75 |
| Mechanical Data | 下载 |
参数化
| Analog Supply (V) | 2.5 Max |
| Architecture | Class AB |
| Audio Input Type | Analog Input |
| Control Interface | Hardware |
| Iq per channel(Typ) | 1.25 mA |
| Iq(Max) | 2.5 mA |
| Iq(Typ) | 1.25 mA |
| Load(Min) | 8 ohms |
| Operating Temperature Range | -40 to 85 C |
| Output Power | 0.7 W |
| PSRR | 85 dB |
| Package Group | SOIC |
| Package Size: mm2:W x L | 8SOIC: 29 mm2: 6 x 4.9(SOIC) PKG |
| Pin/Package | 8MSOP-PowerPAD, 8SOIC |
| Rating | Catalog |
| Shutdown Current (ISD) | 0.0015 uA |
| Speaker Channels | Mono Max |
| THD + N @ 1 kHz | 0.5 % |
生态计划
| RoHS | Compliant |
应用须知
- PowerPAD Thermally Enhanced Package (Rev. H)PDF, 983 Kb, 修订版: H, 档案已发布: Jul 6, 2018
模型线
系列: TPA701 (8)
- TPA701D TPA701DG4 TPA701DGN TPA701DGNG4 TPA701DGNR TPA701DR TPA701DRG4 TPA701EVM
制造商分类
- Semiconductors > Audio > Low-Power Audio Amplifiers (<10W) > Speaker Amplifier Class AB/Class D