Datasheet Texas Instruments 74ALVC164245DGGRG4 — 数据表

制造商	Texas Instruments
系列	SN74ALVC164245
零件号	74ALVC164245DGGRG4

数据表

价格

状态

打包

参数化

生态计划

应用须知

• 下载
  TI SN74ALVC16835 Component Specification Analysis for PC100
  PDF, 43 Kb, 档案已发布: Aug 3, 1998
  The PC100 standard establishes design parameters for the PC SDRAM DIMM that is designed to operate at 100 MHz. The 168-pin, 8-byte, registered SDRAM DIMM is a JEDEC-defined device (JC-42.5-96-146A). Some of the defined signal paths include data signals, address signals, and control signals. This application report discusses the SN74ALVC16835 18-bit universal bus driver that is available from T
• 下载
  Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A)
  PDF, 96 Kb, 修订版: A, 档案已发布: May 13, 1998
  Design of high-performance personal computer (PC) systems that are capable of meeting the needs imposed by modern operating systems and software includes the use of large banks of SDRAMs on DIMMs (see Figure 1).To meet the demands of stable functionality over the broad spectrum of operating environments, meet system timing needs, and to support data integrity, the loads presented by the large
• 下载
  16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
  PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
• 下载
  Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
  PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
  The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
• 下载
  Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
  PDF, 154 Kb, 修订版: A, 档案已发布: Sep 8, 1999
  In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families
• 下载
  Understanding Advanced Bus-Interface Products Design Guide
  PDF, 253 Kb, 档案已发布: May 1, 1996
• 下载
  Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
  PDF, 115 Kb, 档案已发布: Dec 1, 1997
  This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
• 下载
  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Kb, 档案已发布: Aug 29, 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
• 下载
  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
• 下载
  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, 档案已发布: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
• 下载
  Live Insertion
  PDF, 150 Kb, 档案已发布: Oct 1, 1996
  Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
• 下载
  CMOS Power Consumption and CPD Calculation (Rev. B)
  PDF, 89 Kb, 修订版: B, 档案已发布: Jun 1, 1997
  Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
• 下载
  Input and Output Characteristics of Digital Integrated Circuits
  PDF, 1.7 Mb, 档案已发布: Oct 1, 1996
  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou

模型线

制造商分类

• Semiconductors > Logic > Voltage Level Translation > Application Specific Voltage Translation