数字媒体片上系统529-FCBGA -40至105
PDF, 2.4 Mb, 修订版: B, 档案已发布: Jun 10, 2009
This application report provides information on the DM6467 throughput performance and describes the DM6467 System-on-Chip (SoC) architecture, data path infrastructure, and constraints that affect the throughput and different optimization techniques for optimum system performance. This document also provides information on the maximum possible throughput performance of different peripherals on the
PDF, 204 Kb, 档案已发布: Sep 10, 2008
This application report describes the concepts and benefits of SmartReflexв„ў technology implemented in the DM6467 device. Two reference power supply designs that support the SmartReflex feature are also discussed. With the SmartReflex feature enabled, an average of 1W in power savings can be achieved for strong devices. The included reference designs show that additional components are requir
PDF, 93 Kb, 档案已发布: May 5, 2008
This application report describes how to equip the DM6467 device with transmit/receive capabilities via high-definition multimedia interface (HDMI). A general description is provided for all the DM6467 internal peripherals which are required in HDMI transmitting/receiving, as well as the SiI9134 HDMI transmitter and the SiI9135 HDMI receiver. The block diagrams for both the transmit side logic and
PDF, 3.6 Mb, 档案已发布: May 30, 2008
This application report describes the TSM320DM6467 embedded Host electrical compliance of a high-speed (HS) universal serial bus (USB) operation conforming to the USB 2.0 specification. The non-OTG controller supports the USB 2.0 Host mode operation at HS, full-speed (FS), and low-speed (LS) . Furthermore, it supports the USB 2.0 device mode operation at HS and FS. LS operation, when assuming the
PDF, 162 Kb, 修订版: B, 档案已发布: Oct 24, 2009
This application report discusses the power consumption of the Texas Instruments TMS320DM6467 digital media System-on-Chip (DMSoC). Power consumption on the DM6467 device is highly application-dependent; therefore, a spreadsheet that estimates power consumption is provided along with this document. To obtain good results from the spreadsheet, realistic usage parameters must be entered (see Section
PDF, 533 Kb, 档案已发布: Jan 30, 2008
This application report describes the TMS320DM6467 electrical compliance of a high-speed (HS) universal serial bus (USB) operation conforming to the USB 2.0 specification. The non-OTG controller supports the USB 2.0 device-mode operation at HS and FS full-speed (FS) and the USB 2.0 host-mode operation at HS, FS and low-speed (LS).
PDF, 181 Kb, 修订版: A, 档案已发布: Apr 6, 2010
This application report has supplemental information about using the DM646x video port. The tips and tricks in this document are useful in video security applications as well as other applications that make use of the video port.
PDF, 136 Kb, 修订版: D, 档案已发布: Mar 4, 2011
This document describes the functionality of the TMS320DM6467 Digital Media System-on-Chip (DMSoC) ARM ROM bootloader (RBL) software. The ARM ROM bootloader resides in the ROM of the device beginning at address 0x00008000. The RBL implements methods for booting in the listed modes and uses boot configuration pins to determine boot mode. If an improper boot mode is chosen, or an error is detected d
PDF, 85 Kb, 档案已发布: Feb 10, 2009
The DM6467 contains a PCI interface that allows connecting it to a PCI bus in order to communicate with the other peripherals in the system. The DM6467 PCI has a 32-bit data bus. The operating frequency is specified in the device-specific data sheet. This document shows different ways to interface DM6467 devices with the PCI bus.
PDF, 40 Kb, 修订版: B, 档案已发布: Jun 8, 2010
This application report describes an overview of the necessary changes to migrate a DM6467-based design from a DM6467 device (594 MHz or 729 MHz) to a DM6467T (1GHz) device. The DM6467T device requires the changes listed in this document for proper operation. Other system changes may be required to accommodate new speeds or capabilities in the system.
PDF, 119 Kb, 档案已发布: Feb 3, 2009
The Texas Instruments DM646x devices support interfacing to a peripheral component interconnect (PCI) bus through its PCI port. The system or the application may contain a PCI ExpressВ® interface. In order to connect the PCI Express bus to the DM646x PCI bus, an XIO2000A translation bridge is used. XIO2000A is a PCI Express to PCI/PCI-Xв„ў bus translation bridge.
PDF, 311 Kb, 档案已发布: Nov 17, 2008
This document describes considerations for migration from Texas Instruments TMS320DM6446 Digital Media System-on-Chip (DMSoC) to the TMS320DM6467 DMSoC. Both devices feature a dual-core architecture utilizing a high-performance TMS20C64x+в„ў Digital Signal Processor (DSP) core and an ARM926EJ-S central processing unit (CPU) core. While the TMS320DM6446 features video front-end and back-end pro
PDF, 241 Kb, 档案已发布: Nov 17, 2008
This document describes device considerations to migrate a design based on a TI TMS320DM642 video/imaging fixed-point Digital Signal Processor (DSP) to one based on a TI TMS320DM6467 Digital Media System-on-Chip (DMSoC). These two devices are based on similar DSP CPU cores, feature video processing capability, and a mixture of memory and other peripherals useful in a system environment. This docum
PDF, 72 Kb, 修订版: A, 档案已发布: Mar 10, 2010
PDF, 1.3 Mb, 修订版: A, 档案已发布: May 27, 2008
Building a Small Embedded Linux Kernel Example Application Report
PDF, 1.2 Mb, 修订版: A, 档案已发布: Jul 8, 2009
PDF, 969 Kb, 档案已发布: Sep 24, 2009
This application report describes the device differences to be taken care for running the C64x+™ video codec software on different C64x+ based platforms. This document assumes that the codec software is developed for the C64x+ digital signal processor (DSP) core. As many TI platforms have a C64x+ DSP this document gives the details for running the standalone codec software on a C64x+ platfo
PDF, 310 Kb, 修订版: A, 档案已发布: Oct 20, 2005
This document describes migration from the Texas Instruments TMS320C64xв„ў digital signal processor (DSP) to the TMS320C64x+в„ў DSP. The objective of this document is to indicate differences between the two cores and to briefly describe new features. Functionality in the devices that is identical is not included. For detailed information about either device, see the TMS320C64x/C64x+ DSP
PDF, 93 Kb, 修订版: A, 档案已发布: Jul 17, 2008
This application report motivates the way the DDR high-speed timing requirements are now going to be communicated to system designers. The traditional method of using data sheet parameters and simulation models is tedious. The system designer uses this information to evaluate whether timing specifications are met and can be expected to operate reliably.Ultimately, the real question the hardwa
PDF, 127 Kb, 档案已发布: May 20, 2007
As integrated circuit (IC) components become more complex, the challenge of producing an end product with superior thermal performance increases. Thermal performance is a system level concern, impacted by IC packaging as well as by printed circuit board (PCB) design. This application report addresses the thermal considerations for the TMS320DM64xx, TMS320DM64x, and TMS320C6000в„ў DSP devices.
PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
PDF, 535 Kb, 档案已发布: Oct 6, 2011
The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then
