Datasheet Texas Instruments TPS54623RHLT — 数据表
制造商 | Texas Instruments |
系列 | TPS54623 |
零件号 | TPS54623RHLT |
具有轻负载效率的4.5V至17V输入,6A同步降压SWIFT转换器14-VQFN -40至150
数据表
TPS54623 4.5-V to 17-V Input, 6-A Synchronous Step Down SWIFTв„ў Converter With Light Load Efficiency and Hiccup Over Current Protection datasheet
PDF, 1.9 Mb, 修订版: B, 档案已发布: Dec 28, 2016
从文件中提取
价格
状态
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | Yes |
打包
Pin | 14 |
Package Type | RHL |
Industry STD Term | VQFN |
JEDEC Code | S-PQFP-N |
Package QTY | 250 |
Carrier | SMALL T&R |
Device Marking | 54623 |
Width (mm) | 3.5 |
Length (mm) | 3.5 |
Thickness (mm) | .9 |
Pitch (mm) | .5 |
Max Height (mm) | 1 |
Mechanical Data | 下载 |
参数化
Control Mode | Current Mode |
Duty Cycle(Max) | 98 % |
Iout(Max) | 6 A |
Iq(Typ) | 0.25 mA |
Operating Temperature Range | -40 to 150 C |
Package Group | VQFN |
Rating | Catalog |
Regulated Outputs | 1 |
Special Features | Enable,Frequency Synchronization,Light Load Efficiency,Power Good,Pre-Bias Start-Up,Synchronous Rectification,Tracking |
Switching Frequency(Max) | 1600 kHz |
Switching Frequency(Min) | 200 kHz |
Type | Converter |
Vin(Max) | 17 V |
Vin(Min) | 4.5 V |
Vout(Max) | 15 V |
Vout(Min) | 0.6 V |
生态计划
RoHS | Compliant |
设计套件和评估模块
- Evaluation Modules & Boards: TPS54623EVM-012
Evaluation Module for TPS54623 Synchronous Step-Down SWIFT Converter
Lifecycle Status: Active (Recommended for new designs)
应用须知
- Calculating EfficiencyPDF, 175 Kb, 档案已发布: Feb 19, 2010
This application report provides a step-by-step procedure for calculating buck converter efficiency and power dissipation at operating points not provided by the data sheet. - Understanding Thermal Dissipation and Design of a HeatsinkPDF, 59 Kb, 档案已发布: May 4, 2011
Power dissipation performance must be well understood prior to integrating devices on a printed-circuit board (PCB) to ensure that any given device is operated within its defined temperature limits. When a device is running, it consumes electrical energy that is transformed into heat. Most of the heat is typically generated by switching devices like MOSFETs, ICs, etc. This application report discu - Semiconductor and IC Package Thermal Metrics (Rev. C)PDF, 201 Kb, 修订版: C, 档案已发布: Apr 19, 2016
模型线
系列: TPS54623 (2)
- TPS54623RHLR TPS54623RHLT
制造商分类
- Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)