Datasheet Texas Instruments TMP006BIYZFR — 数据表

制造商Texas Instruments
系列TMP006
零件号TMP006BIYZFR
Datasheet Texas Instruments TMP006BIYZFR

WCSP封装中的红外热电堆非接触式温度传感器8-DSBGA -40至125

数据表

TMP006/B Infrared Thermopile Sensor in Chip-Scale Package datasheet
PDF, 725 Kb, 修订版: E, 档案已发布: Apr 9, 2015

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin8
Package TypeYZF
Industry STD TermDSBGA
JEDEC CodeS-XBGA-N
Package QTY3000
CarrierLARGE T&R
Device MarkingT006B
Width (mm)1.75
Length (mm)1.75
Pitch (mm).5
Max Height (mm).625
Mechanical Data下载

参数化

Approx. Price (US$)1.50 | 1ku
Infrared Sensor Accuracy(Max)(+/- C)3
InterfaceI2C
SMBus
2-Wire
Local Sensor Accuracy(Max)(+/- C)1
Operating Temperature Range(C)-40 to 125
Package GroupDSBGA
Special FeaturesShutdown
Supply Current(Typ)(uA)240
Supply Voltage(Max)(V)5.5V
Supply Voltage(Min)(V)2.2
Temp Range for Listed Accuracy(C)0 to 60
Temp Resolution(Max)(bits)14

生态计划

RoHSCompliant
Pb FreeYes

设计套件和评估模块

  • Evaluation Modules & Boards: TMP006EVM
    TMP006 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: BOOSTXL-SENSHUB
    Sensor Hub BoosterPack
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: BOOSTXL-EDUMKII
    Educational BoosterPack MKII
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • TMP006 and TMP007: Through-Hole Mounting Method
    PDF, 1.8 Mb, 档案已发布: Sep 1, 2016
    This applicationnotedescribesa new methodof mountingTMP007WCSPdie on the printed-circuitboard(PCB).The advantagesof the new methodare describedand mountingrecommendationsare provided.All of the followingrecommendationsand conclusionsare also true for TMP006parts.
  • AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)
    PDF, 13.7 Mb, 修订版: AG, 档案已发布: Aug 12, 2015
  • Understanding the I2C Bus
    PDF, 124 Kb, 档案已发布: Jun 30, 2015

模型线

制造商分类

  • Semiconductors > Sensing Products > Temperature Sensors > IR & Probe Temperature Sensors