Datasheet Texas Instruments CLVTH16245AQDGGRQ1 — 数据表

制造商	Texas Instruments
系列	SN74LVTH16245A-Q1
零件号	CLVTH16245AQDGGRQ1

具有三态输出的汽车类3.3V ABT 16位总线收发器48-TSSOP -40至125

数据表

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PDF, 152 Kb, 修订版: C, 档案已发布: Jan 18, 2008

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价格

状态

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	Yes

打包

Pin	48
Package Type	DGG
Industry STD Term	TSSOP
JEDEC Code	R-PDSO-G
Package QTY	2000
Carrier	LARGE T&R
Device Marking	LH16245AQ1
Width (mm)	6.1
Length (mm)	12.5
Thickness (mm)	1.15
Pitch (mm)	.5
Max Height (mm)	1.2
Mechanical Data	下载

参数化

Bits	16
F @ Nom Voltage(Max)	160 Mhz
ICC @ Nom Voltage(Max)	5 mA
Operating Temperature Range	-40 to 125 C
Output Drive (IOL/IOH)(Max)	-24/24 mA
Package Group	TSSOP
Package Size: mm2:W x L	48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) PKG
Rating	Automotive
Schmitt Trigger	No
Technology Family	LVT
VCC(Max)	3.6 V
VCC(Min)	2.7 V
Voltage(Nom)	3.3 V
tpd @ Nom Voltage(Max)	4.5 ns

生态计划

RoHS

Compliant

应用须知

下载
LVT Family Characteristics (Rev. A)
PDF, 98 Kb, 修订版: A, 档案已发布: Mar 1, 1998
To address the need for a complete low-voltage interface solution, Texas Instruments has developed a new generation of logic devices capable of mixed-mode operation. The LVT series relies on a state-of-the-art submicron BiCMOS process to provide up to a 90% reduction in static power dissipation over ABT. LVT devices solve the system need for a transparent seam between the low-voltage and 5-V secti
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LVT-to-LVTH Conversion
PDF, 84 Kb, 档案已发布: Dec 8, 1998
Original LVT devices that have bus hold have been redesigned to add the High-Impedance State During Power Up and Power Down feature. Additional devices with and without bus hold have been added to the LVT product line. Design guidelines and issues related to the bus-hold features, switching characteristics, and timing requirements are discussed.
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16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
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Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
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Understanding Advanced Bus-Interface Products Design Guide
PDF, 253 Kb, 档案已发布: May 1, 1996
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Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
PDF, 209 Kb, 档案已发布: May 10, 2002
Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

模型线

系列: SN74LVTH16245A-Q1 (1)

CLVTH16245AQDGGRQ1

制造商分类

Semiconductors > Logic > Buffer/Driver/Transceiver > Standard Transceiver