Datasheet Texas Instruments OMAPL138BGWTMEP — 数据表
| 制造商 | Texas Instruments |
| 系列 | OMAPL138B-EP |
| 零件号 | OMAPL138BGWTMEP |
增强型产品低功耗应用处理器361-NFBGA -55至125
数据表
价格
状态
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
打包
| Pin | 361 | 361 | 361 |
| Package Type | GWT | GWT | GWT |
| Industry STD Term | NFBGA | NFBGA | NFBGA |
| JEDEC Code | S-PBGA-N | S-PBGA-N | S-PBGA-N |
| Package QTY | 90 | 90 | 90 |
| Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) |
| Device Marking | GWTMEP | 21 | OMAPL138B |
| Width (mm) | 16 | 16 | 16 |
| Length (mm) | 16 | 16 | 16 |
| Thickness (mm) | .9 | .9 | .9 |
| Pitch (mm) | .8 | .8 | .8 |
| Max Height (mm) | 1.4 | 1.4 | 1.4 |
| Mechanical Data | 下载 | 下载 | 下载 |
参数化
| ARM CPU | 1 ARM9 |
| ARM MHz | 345 Max. |
| Applications | Communications and Telecom,Energy,Industrial,Medical |
| DRAM | LPDDR,DDR2 |
| DSP | 1 C674x |
| DSP MHz | 345 Max. |
| Display Options | 1 |
| EMAC | 10/100 |
| I2C | 2 |
| On-Chip L2 Cache | 256 KB (DSP) |
| Operating Systems | Linux,SYS/BIOS |
| Operating Temperature Range | -55 to 125 C |
| Other On-Chip Memory | 128 KB |
| Rating | HiRel Enhanced Product |
| SPI | 2 |
| UART | 3 SCI |
| USB | 2 |
| Video Port | 1 Configurable |
生态计划
| RoHS | See ti.com |
设计套件和评估模块
- JTAG Emulators/ Analyzers: TMDSEMU200-U
XDS200 USB Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
XDS560v2 System Trace USB & Ethernet Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
XDS560v2 System Trace USB Debug Probe
Lifecycle Status: Active (Recommended for new designs)
应用须知
- nFBGA Packaging (Rev. B)PDF, 3.1 Mb, 修订版: B, 档案已发布: Nov 13, 2015
This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts. - Processor SDK RTOS Audio Benchmark Starter KitPDF, 530 Kb, 档案已发布: Apr 12, 2017
The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
- Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
模型线
系列: OMAPL138B-EP (2)
- OMAPL138BGWTMEP V62/12605-01XE
制造商分类
- Semiconductors > Space & High Reliability > Processor > Digital Signal Processor > C6000 DSP + ARM Processor