LF412QML
www.ti.com SNOSAO7A – DECEMBER 2010 – REVISED MARCH 2013 LF412QML Low Offset, Low Drift Dual JFET Input Operational Amplifier
Check for Samples: LF412QML FEATURES DESCRIPTION 1 23 Input Offset Voltage Drift: 20 ОјV/В°C (Max)
Low Input Bias Current: 50 pA (Typ)
Low Input Noise Current: 0.01 pA/в€љHz (Typ)
Wide Gain Bandwidth: 2.7 MHz (Min)
High Slew Rate: 8V/Ојs (Min)
High Input Impedance: 1012О©
Low Total Harmonic Distortion T LF412MJ/883 ACTIVE CDIP NAB 8 40 TBD Call TI Call TI -55 to 125 LF412MJ
/883 Q ACO
/883 Q >T (1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan -The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) -please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. …
