Datasheet Texas Instruments LMR24220TL/NOPB — 数据表

制造商	Texas Instruments
系列	LMR24220
零件号	LMR24220TL/NOPB

数据表

价格

状态

打包

参数化

生态计划

设计套件和评估模块

• Evaluation Modules & Boards: LMR24220RB
  LMR24220 5-Watt Multi-Rail Power Supply Reference Board
  Lifecycle Status: Active (Recommended for new designs)
  
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• Evaluation Modules & Boards: LMR24220EVAL
  LMR24220 Small Footprint 42V Buck Regulator 2A Evaluation Board
  Lifecycle Status: Active (Recommended for new designs)
  
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应用须知

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  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Kb, 修订版: B, 档案已发布: May 3, 2004
  Application Note 643 EMI/RFI Board Design
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  Inverting Applications Made SIMPLE With LM4600x and LM4360x (Rev. B)
  PDF, 1.9 Mb, 修订版: B, 档案已发布: Feb 20, 2015
  Weoftenrequirepowersourceswithnegativeoutputvoltages.Therearemanydifferentwaystoproduceanegativeoutputvoltagefromapositiveinputvoltage.Oneoptionisapolarity-invertingbuck-boostconverter.Theadvantagesofthistopologyarethatitrequireslowcomponentcountandthatitcanbebuiltwithstandardhigh-sideregulato
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  Input and Output Capacitor Selection
  PDF, 219 Kb, 档案已发布: Sep 19, 2005
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  AN-1197 Selecting Inductors for Buck Converters (Rev. B)
  PDF, 558 Kb, 修订版: B, 档案已发布: Apr 23, 2013
  This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
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  Thermal Design Made Simple With LM43603 and LM46002
  PDF, 535 Kb, 档案已发布: Sep 15, 2014
  This Application Report will walk through the thermal design of power supplies using the LM43603 and LM46002.In the process we will cover common tips and approximations to speed up your design.
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  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, 修订版: A, 档案已发布: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
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  AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
  PDF, 1.4 Mb, 修订版: A, 档案已发布: Apr 23, 2013
  This application note provides thermal power analysis techniques for analyzing the power IC.
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  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Mb, 修订版: A, 档案已发布: Apr 23, 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
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  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, 修订版: C, 档案已发布: Apr 19, 2016
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  Cap Drop Offline Supply for E-Meters
  PDF, 291 Kb, 档案已发布: Jun 16, 2015
  This design idea provides a simple non-isolated AC/DC power supply for low power applications such assmart grid E-meter applications. The design uses a "capacitive-dropper" front-end combined with aLM46000 SIMPLE SWITCHERВ® buck regulator from Texas Instruments. The circuit provides 3.3 V at aminimum of 50 mA from a line supply of 90 VAC to 265 VAC. Theory of operation as well as designequa
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  Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)
  PDF, 512 Kb, 修订版: A, 档案已发布: Sep 12, 2014
  Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x
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  Absolute Maximum Ratings for Soldering (Rev. D)
  PDF, 52 Kb, 修订版: D, 档案已发布: Jun 9, 2016
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  Automotive Line Transient Protection Circuit
  PDF, 346 Kb, 档案已发布: Jul 1, 2014
  Automobileelectricalpowersystemsaresubjectedtomanytortuousconditionsoverthelifeofthevehicle.Inaddtiontoadverseconditionsonthebatterypowerbus,therearealsooperatingextremesduetoenvironmentalfactorssuchastemperature,humidityandlongtermvehiclestorage.Thisapplicationnotewilldiscusshowthesetransientco
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  Compensation Made SIMPLE With LM4360x, LM4600x
  PDF, 457 Kb, 档案已发布: Jul 29, 2014
  Compensating a DC-DC buck converter is challenging if the designer is not familiar with the loop control theory. To achieve a stable design under all corner and adverse conditions, the user must properly compensate the regulator. While DC-DC converters with external compensation provide flexibility, they increase complexity. The LM43600/1/2/3 and LM46000/1/2 are a family of Wide VIN, fully-synchro
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  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Kb, 修订版: C, 档案已发布: Apr 23, 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
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  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Kb, 修订版: C, 档案已发布: Apr 23, 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
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  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, 修订版: C, 档案已发布: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
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  AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)
  PDF, 427 Kb, 修订版: C, 档案已发布: Apr 23, 2013
  This application note discusses stresses in wide input DC-DC converters.
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  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, 修订版: B, 档案已发布: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

模型线

制造商分类

• Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)