PDF, 132 Kb, 档案已发布: Nov 13, 2009
This application report discusses the power consumption of the Texas Instruments TMS320DM6467T digital media System-on-Chip (DMSoC). Power consumption on the DM6467T device is highly application-dependent; therefore, a spreadsheet that estimates power consumption is provided along with this document. To obtain good results from the spreadsheet, realistic usage parameters must be entered (see Secti
PDF, 136 Kb, 修订版: D, 档案已发布: Mar 4, 2011
This document describes the functionality of the TMS320DM6467 Digital Media System-on-Chip (DMSoC) ARM ROM bootloader (RBL) software. The ARM ROM bootloader resides in the ROM of the device beginning at address 0x00008000. The RBL implements methods for booting in the listed modes and uses boot configuration pins to determine boot mode. If an improper boot mode is chosen, or an error is detected d
PDF, 40 Kb, 修订版: B, 档案已发布: Jun 8, 2010
This application report describes an overview of the necessary changes to migrate a DM6467-based design from a DM6467 device (594 MHz or 729 MHz) to a DM6467T (1GHz) device. The DM6467T device requires the changes listed in this document for proper operation. Other system changes may be required to accommodate new speeds or capabilities in the system.
PDF, 85 Kb, 档案已发布: Feb 10, 2009
The DM6467 contains a PCI interface that allows connecting it to a PCI bus in order to communicate with the other peripherals in the system. The DM6467 PCI has a 32-bit data bus. The operating frequency is specified in the device-specific data sheet. This document shows different ways to interface DM6467 devices with the PCI bus.
PDF, 181 Kb, 修订版: A, 档案已发布: Apr 6, 2010
This application report has supplemental information about using the DM646x video port. The tips and tricks in this document are useful in video security applications as well as other applications that make use of the video port.
PDF, 119 Kb, 档案已发布: Feb 3, 2009
The Texas Instruments DM646x devices support interfacing to a peripheral component interconnect (PCI) bus through its PCI port. The system or the application may contain a PCI ExpressВ® interface. In order to connect the PCI Express bus to the DM646x PCI bus, an XIO2000A translation bridge is used. XIO2000A is a PCI Express to PCI/PCI-Xв„ў bus translation bridge.
PDF, 1.3 Mb, 修订版: A, 档案已发布: May 27, 2008
Building a Small Embedded Linux Kernel Example Application Report
PDF, 969 Kb, 档案已发布: Sep 24, 2009
This application report describes the device differences to be taken care for running the C64x+™ video codec software on different C64x+ based platforms. This document assumes that the codec software is developed for the C64x+ digital signal processor (DSP) core. As many TI platforms have a C64x+ DSP this document gives the details for running the standalone codec software on a C64x+ platfo
PDF, 126 Kb, 修订版: B, 档案已发布: Jul 7, 1999
Texas Instruments (TI[TM]) next-generation logic is called the Advanced Very-low-voltage CMOS (AVC) family. The AVCfamily features TI?s Dynamic Output Control (DOC[TM]) circuit (patent pending). DOC circuitry automatically lowers the outputimpedance of the circuit at the beginning of a signal transition, providing enough current to achieve high signaling speeds, thensubsequently raises the i
PDF, 148 Kb, 修订版: A, 档案已发布: Aug 26, 1998
Texas Instruments (TI?) announces the industry?s first logic family to achieve maximum propagation delays of less than 2 ns at 2.5 V. TI?s next-generation logic is the Advanced Very-low-voltage CMOS (AVC) family. Although optimized for 2.5-V systems, AVC logic supports mixed-voltage systems because it is compatible with 3.3-V and 1.8-V devices. The AVC family features TI?s Dynamic Output Control (
PDF, 390 Kb, 修订版: B, 档案已发布: Apr 30, 2015
PDF, 93 Kb, 修订版: A, 档案已发布: Jul 17, 2008
This application report motivates the way the DDR high-speed timing requirements are now going to be communicated to system designers. The traditional method of using data sheet parameters and simulation models is tedious. The system designer uses this information to evaluate whether timing specifications are met and can be expected to operate reliably.Ultimately, the real question the hardwa
PDF, 127 Kb, 档案已发布: May 20, 2007
As integrated circuit (IC) components become more complex, the challenge of producing an end product with superior thermal performance increases. Thermal performance is a system level concern, impacted by IC packaging as well as by printed circuit board (PCB) design. This application report addresses the thermal considerations for the TMS320DM64xx, TMS320DM64x, and TMS320C6000в„ў DSP devices.
PDF, 310 Kb, 修订版: A, 档案已发布: Oct 20, 2005
This document describes migration from the Texas Instruments TMS320C64xв„ў digital signal processor (DSP) to the TMS320C64x+в„ў DSP. The objective of this document is to indicate differences between the two cores and to briefly describe new features. Functionality in the devices that is identical is not included. For detailed information about either device, see the TMS320C64x/C64x+ DSP
PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
PDF, 313 Kb, 修订版: A, 档案已发布: Jun 22, 2004
Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
