Datasheet Texas Instruments SN74AVC4T774RSVR — 数据表

制造商Texas Instruments
系列SN74AVC4T774
零件号SN74AVC4T774RSVR
Datasheet Texas Instruments SN74AVC4T774RSVR

具有可配置电压电平转换和三态输出的4位双电源总线收发器16-UQFN -40至85

数据表

SN74AVC4T774 4-Bit Dual-Supply Bus Transceiver With Configurable Voltage Translation and 3-State Outputs datasheet
PDF, 1.2 Mb, 修订版: D, 档案已发布: Jan 20, 2015
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

打包

Pin16
Package TypeRSV
Industry STD TermUQFN
JEDEC CodeR-PQFP-N
Package QTY3000
CarrierLARGE T&R
Device MarkingZVK
Width (mm)1.8
Length (mm)2.6
Thickness (mm).5
Pitch (mm).4
Max Height (mm).55
Mechanical Data下载

参数化

Bits4
F @ Nom Voltage(Max)100 Mhz
ICC @ Nom Voltage(Max)0.016 mA
Operating Temperature Range-40 to 85 C
Package GroupUQFN
Package Size: mm2:W x L16UQFN: 5 mm2: 1.8 x 2.6(UQFN) PKG
RatingCatalog
Schmitt TriggerNo
Technology FamilyAVC
VCC(Max)3.6 V
VCC(Min)1.2 V
Voltage(Nom)1.2,1.5,1.8,2.5,3.3 V
tpd @ Nom Voltage(Max)3.5,3.1,2.8,2.6,2.5 ns

生态计划

RoHSCompliant

设计套件和评估模块

  • Evaluation Modules & Boards: CC256XQFNEM
    Dual-mode BluetoothВ® CC2564 evaluation board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: CC2564MODNEM
    Dual-mode BluetoothВ® CC2564 module evaluation board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: CC2564MODAEM
    Dual-mode BluetoothВ® CC2564 Module with Integrated Antenna Evaluation Board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: BOOST-CC2564MODA
    Dual-mode BluetoothВ® CC2564 module with integrated antenna BoosterPackВ™ plug-in module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TAS2557EVM
    TAS2557 5.7-W Class-D Audio Amplifier Evaluation Module with Class-H Boost and Speaker Sense
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TAS2559EVM
    TAS2559 5.7-W Class-D Audio Amplifier Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TAS2560EVM
    TAS2560 5.6W Class-D Audio Amplifier Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: DLPDLCR4710EVM-G2
    Full HD DLP4710 Chipset Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • Dynamic Output Control (DOC) Circuitry Technology And Applications (Rev. B)
    PDF, 126 Kb, 修订版: B, 档案已发布: Jul 7, 1999
    Texas Instruments (TI[TM]) next-generation logic is called the Advanced Very-low-voltage CMOS (AVC) family. The AVCfamily features TI?s Dynamic Output Control (DOC[TM]) circuit (patent pending). DOC circuitry automatically lowers the outputimpedance of the circuit at the beginning of a signal transition, providing enough current to achieve high signaling speeds, thensubsequently raises the i
  • AVC Logic Family Technology and Applications (Rev. A)
    PDF, 148 Kb, 修订版: A, 档案已发布: Aug 26, 1998
    Texas Instruments (TI?) announces the industry?s first logic family to achieve maximum propagation delays of less than 2 ns at 2.5 V. TI?s next-generation logic is the Advanced Very-low-voltage CMOS (AVC) family. Although optimized for 2.5-V systems, AVC logic supports mixed-voltage systems because it is compatible with 3.3-V and 1.8-V devices. The AVC family features TI?s Dynamic Output Control (
  • Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B)
    PDF, 390 Kb, 修订版: B, 档案已发布: Apr 30, 2015
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa

模型线

制造商分类

  • Semiconductors > Logic > Voltage Level Translation > Direction Controlled Voltage Translation