Datasheet Texas Instruments 66AK2G01 — 数据表
| 制造商 | Texas Instruments |
| 系列 | 66AK2G01 |
多核DSP + ARM KeyStone II片上系统（SoC）
数据表
66AK2G0x Multicore DSP+ARM KeyStone II System-on-Chip (SoC) datasheet
PDF, 2.6 Mb, 修订版: E, 档案已发布: Jun 8, 2017
从文件中提取
价格
状态
| X66AK2G01ZBB60 | |
|---|---|
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
打包
| X66AK2G01ZBB60 | |
|---|---|
| N | 1 |
| Pin | 625 |
| Package Type | ZBB |
| Package QTY | 1 |
| Carrier | JEDEC TRAY (5+1) |
| Width (mm) | 21 |
| Length (mm) | 21 |
| Thickness (mm) | 1.16 |
| Mechanical Data | 下载 |
参数化
| Parameters / Models | X66AK2G01ZBB60 |
|---|---|
| ARM CPU | 1 ARM Cortex-A15 |
| ARM MHz, Max. | 600 |
| Applications | Communications and Telecom,Consumer Electronics,Industrial,Test and Measurement |
| DRAM | DDR3L |
| DSP | 1 C66x |
| DSP MHz, Max. | 600 |
| EMAC | 1-port 1Gb |
| Hardware Accelerators | Security Accelerator |
| I2C | 3 |
| On-Chip L2 Cache | 512KB w/ECC ARM Cortex-A15,1024KB w/ECC C66x DSP |
| Operating Systems | Linux,TI-RTOS |
| Operating Temperature Range, C | 0 to 70 |
| Other On-Chip Memory | 1024KB w/ECC |
| Rating | Catalog |
| SPI | 4 |
| UART, SCI | 3 |
| USB | 1 |
生态计划
| X66AK2G01ZBB60 | |
|---|---|
| RoHS | See ti.com |
应用须知
- 66AK2G02 Power Estimation ToolPDF, 27 Kb, 档案已发布: Jun 15, 2017
This power estimation spreadsheet provides power consumption estimates based on measured and simulated data; they are provided “as is” and are not ensured within a specified precision. Power consumption depends on electrical parameters, silicon process variations, environmental conditions, and use cases running on the processor during operation. Actual power consumption should be verified in the r - Hardware Design Guide for KeyStone II DevicesPDF, 1.8 Mb, 档案已发布: Mar 24, 2014
- SERDES Link Commissioning on KeyStone I and II DevicesPDF, 138 Kb, 档案已发布: Apr 13, 2016
The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices. - DDR3 Design Requirements for KeyStone Devices (Rev. B)PDF, 582 Kb, 修订版: B, 档案已发布: Jun 5, 2014
- Processor SDK RTOS Audio Benchmark Starter KitPDF, 530 Kb, 档案已发布: Apr 12, 2017
The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device - PRU-ICSS Feature ComparisonPDF, 29 Kb, 档案已发布: Jun 5, 2017
This application report documents the feature differences between the PRU subsystems available on different TI processors. - TI DSP BenchmarkingPDF, 62 Kb, 档案已发布: Jan 13, 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms. - High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
模型线
系列: 66AK2G01 (1)
制造商分类
- Semiconductors> Processors> Digital Signal Processors> C6000 DSP + ARM Processors> 66AK2x