Datasheet Texas Instruments AM1806 — 数据表

制造商Texas Instruments
系列AM1806
Datasheet Texas Instruments AM1806

Sitara处理器

数据表

AM1806 ARM Microprocessor datasheet
PDF, 1.8 Mb, 修订版: F, 档案已发布: Mar 21, 2014
从文件中提取

价格

状态

AM1806BZCE3AM1806BZCE4AM1806BZCEA3AM1806BZCED4AM1806BZWT3AM1806BZWT4AM1806BZWTD4AM1806EZCE3AM1806EZCE4AM1806EZCEA3AM1806EZCED4AM1806EZWT3AM1806EZWT4AM1806EZWTD4
Lifecycle StatusObsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoYesYesNoNoNoYesYesNoYesNoNoNo

打包

AM1806BZCE3AM1806BZCE4AM1806BZCEA3AM1806BZCED4AM1806BZWT3AM1806BZWT4AM1806BZWTD4AM1806EZCE3AM1806EZCE4AM1806EZCEA3AM1806EZCED4AM1806EZWT3AM1806EZWT4AM1806EZWTD4
N1234567891011121314
Pin361361361361361361361361361361361361361361
Package TypeZCEZCEZCEZCEZWTZWTZWTZCEZCEZCEZCEZWTZWTZWT
Industry STD TermNFBGANFBGANFBGANFBGANFBGANFBGANFBGANFBGANFBGANFBGANFBGANFBGANFBGANFBGA
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-N
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device MarkingAM1806B456AM1806BD456ZWTAM1806BD456AM1806E456ZCEZCE375456ZWT
Width (mm)1313131316161613131313161616
Length (mm)1313131316161613131313161616
Thickness (mm).89.89.89.89.9.9.9.89.89.89.89.9.9.9
Pitch (mm).65.65.65.65.8.8.8.65.65.65.65.8.8.8
Max Height (mm)1.31.31.31.31.41.41.41.31.31.31.31.41.41.4
Mechanical Data下载下载下载下载下载下载下载下载下载下载下载下载下载下载
Package QTY160160160160909090

参数化

Parameters / ModelsAM1806BZCE3
AM1806BZCE3
AM1806BZCE4
AM1806BZCE4
AM1806BZCEA3
AM1806BZCEA3
AM1806BZCED4
AM1806BZCED4
AM1806BZWT3
AM1806BZWT3
AM1806BZWT4
AM1806BZWT4
AM1806BZWTD4
AM1806BZWTD4
AM1806EZCE3
AM1806EZCE3
AM1806EZCE4
AM1806EZCE4
AM1806EZCEA3
AM1806EZCEA3
AM1806EZCED4
AM1806EZCED4
AM1806EZWT3
AM1806EZWT3
AM1806EZWT4
AM1806EZWT4
AM1806EZWTD4
AM1806EZWTD4
ARM CPU1 ARM91 ARM91 ARM91 ARM91 ARM91 ARM91 ARM91 ARM91 ARM91 ARM91 ARM91 ARM91 ARM91 ARM9
ARM MHz, Max.375,456375,456375,456375,456375,456375,456375,456375,456375,456375,456375,456375,456375,456375,456
ApplicationsIndustrial,Personal ElectronicsIndustrial,Personal ElectronicsIndustrial,Personal ElectronicsIndustrial,Personal ElectronicsIndustrial,Personal ElectronicsIndustrial,Personal ElectronicsIndustrial,Personal ElectronicsIndustrial,Personal ElectronicsIndustrial,Personal ElectronicsIndustrial,Personal ElectronicsIndustrial,Personal ElectronicsIndustrial,Personal ElectronicsIndustrial,Personal ElectronicsIndustrial,Personal Electronics
DRAMDDR2,LPDDRDDR2,LPDDRDDR2,LPDDRDDR2,LPDDRDDR2,LPDDRDDR2,LPDDRDDR2,LPDDRDDR2,LPDDRDDR2,LPDDRDDR2,LPDDRDDR2,LPDDRDDR2,LPDDRDDR2,LPDDRDDR2,LPDDR
Display OptionsLCDLCDLCDLCDLCDLCDLCDLCDLCDLCDLCDLCDLCDLCD
EMACNoNoNoNoNoNoNoNoNoNoNoNoNoNo
I2C22222222222222
On-Chip L2 Cache128 KB (ARM9)128 KB (ARM9)128 KB (ARM9)128 KB (ARM9)128 KB (ARM9)128 KB (ARM9)128 KB (ARM9)128 KB (ARM9)128 KB (ARM9)128 KB (ARM9)128 KB (ARM9)128 KB (ARM9)128 KB (ARM9)128 KB (ARM9)
Operating SystemsAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Operating Temperature Range, C-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90-40 to 105,0 to 90,-40 to 90
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
SPI22222222222222
UART, SCI33333333333333
USB11111111111111

生态计划

AM1806BZCE3AM1806BZCE4AM1806BZCEA3AM1806BZCED4AM1806BZWT3AM1806BZWT4AM1806BZWTD4AM1806EZCE3AM1806EZCE4AM1806EZCEA3AM1806EZCED4AM1806EZWT3AM1806EZWT4AM1806EZWTD4
RoHSNot CompliantNot CompliantNot CompliantNot CompliantCompliantNot CompliantNot CompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliant

应用须知

  • Powering the AM1806, AM1808, and AM1810 with the TPS650061
    PDF, 461 Kb, 档案已发布: Sep 6, 2011
  • AM18x Power Consumption Summary
    PDF, 19 Kb, 档案已发布: Aug 30, 2010
    This article discusses the power consumption of the Texas Instruments AM18x. Power consumption on the AM18x devices are highly application-dependent. The low-core voltage and other power design optimizations allow these devices to operate with industry-leading performance, while maintaining a low power-to-performance ratio.The power data presented in this document are based on measured data w
  • AM18xx Pin Multiplexing Utility (Rev. A)
    PDF, 32 Kb, 修订版: A, 档案已发布: Dec 6, 2011
    The AM18xx devices use a great deal of internal pin multiplexing to allow the most functionality in the smallest and lowest cost package. This software allows the pin multiplexing registers of the device to be calculated with ease, as well as showing what peripherals can be used together and what devices support the peripherals that are selected. This software is useful to anyone creating a system
  • Using the AM18xx Bootloader (Rev. C)
    PDF, 1.6 Mb, 修订版: C, 档案已发布: Jan 23, 2014
    This application report describes various boot mechanisms supported by the AM18xx bootloader read-only memory (ROM) image. Topics covered include the Application Image Script (AIS) boot process, an AISgen tool used to generate boot scripts, protocol for booting the device from an external master device, a UART Boot Host GUI for booting the device from a host PC, and any limitations, default settin
  • WiLink 6.0 (WL1271) OpenLink Platform (Rev. A)
    PDF, 735 Kb, 修订版: A, 档案已发布: Apr 26, 2011
  • OMAP-L1x8 Complementary Products
    PDF, 26 Kb, 档案已发布: Jul 20, 2009
    This article has been contributed to the TI DaVinciв„ў and OMAPв„ў Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://tiexpressdsp.com/index.php/OMAP-L1x8_Complementary_Products .This Wiki article serves as a repository of complimentary devices that ca
  • Powering OMAP-L132/L138, C6742/4/6, and AM18x with TPS65070 (Rev. B)
    PDF, 453 Kb, 修订版: B, 档案已发布: Aug 29, 2011
    This documents details the design consideration of a power management unit (PMU) solution for the OMAP-L132/-L138 low-power applications processors with a TPS65070 five-channel power management device.
  • OMAP-L13x/AM1x Linux PSP Overview
  • Medium Integrated Power Solution Using a Dual DC/DC Converter and an LDO (Rev. B)
    PDF, 387 Kb, 修订版: B, 档案已发布: Aug 29, 2011
    This reference design is intended for users designing with the TMS320C6742, TMS320C6746, TMS320C6748, or OMAP-L132/L138 processor. Using sequenced power supplies, this reference design describes a system having a 3.3-V input voltage and a high-efficiency dc/dc converter with integrated FETs for a small, simple design.Sequenced power supply architectures are becoming commonplace in high-performan
  • High-Vin, High-Efficiency Power Solution Using DC/DC Converter With DVFS (Rev. C)
    PDF, 266 Kb, 修订版: C, 档案已发布: Aug 29, 2011
    This reference design is intended for users designing with the TMS320C6742, TMS320C6746, TMS320C6748, or OMAP-L132/L138 processor. Using sequenced power supplies, this reference design describes a system having a 12-V input voltage and a high-efficiency dc/dc converter with integrated FETs and dynamic voltage and frequency scaling (DVFS) for a small, simple design.Sequenced power supply architec
  • Simple Power Solution Using LDOs (Rev. B)
    PDF, 150 Kb, 修订版: B, 档案已发布: Aug 29, 2011
    This reference design helps those desiring to design-in the TMS320C6742, TMS320C6746, TMS320C6748, and OMAP-L132/L138. This design, employing sequenced power supplies, describes asystem with an input voltage of 3.3 V, and uses LDOs for a small, simple system.Sequenced power supply architectures are becoming commonplace in high-performance microprocessor and digital signal processor (DSP) syste
  • High-Efficiency Power Solution Using DC/DC Converters With DVFS (Rev. A)
    PDF, 161 Kb, 修订版: A, 档案已发布: May 5, 2010
    This reference design is intended for users designing with the TMS320C6742, TMS320C6746, TMS320C6748, OMAP-L138 or AM18x processor. Using sequenced power supplies, this reference design describes a system having a 12-V input voltage and a high-efficiency dc/dc converter with ntegrated FETs and dynamic voltage and frequency scaling (DVFS) for a small, simple design.Sequenced power supply archit
  • TMS320C6748/46/42 & OMAP-L132/L138 USB Downstream Host Compliance Testing
    PDF, 3.6 Mb, 档案已发布: Aug 17, 2009
    This application report describes the TMS320C6748/46/42 and OMAP-L1x8 embedded Host electrical compliance of a high-speed (HS) universal serial bus (USB) operation conforming to the USB 2.0 specification. The OTG controller supports the USB 2.0 device and host mode at high-speed (HS), full-speed (FS) and low-speed (LS).
  • TMS320C6748/46/42 & OMAP-L1x8 USB Upstream Device Compliance Testing
    PDF, 1.1 Mb, 档案已发布: Aug 17, 2009
    This application report describes the TMS320C6748/46/42 and OMAP-L1x8 electrical compliance of a high-speed (HS) universal serial bus (USB) operation conforming to the USB 2.0 specification. The on-the-go (OTG) controller supports the USB 2.0 device and host mode at high-speed (HS), full-speed (FS) and low-speed (LS).
  • High-Integration, High-Efficiency Power Solution Using DC/DC Converters w/DVFS (Rev. A)
    PDF, 208 Kb, 修订版: A, 档案已发布: May 5, 2010
    This reference design is intended for users designing with the TMS320C6742, TMS320C6746, TMS320C6748, OMAP-L138 or AM18x processor. Using sequenced power supplies, this reference design describes a system having a 12-V input voltage and a high-efficiency dc/dc converter with ntegrated FETs and dynamic voltage and frequency scaling (DVFS) for a small, simple design.Sequenced power supply archit
  • TMS320C674x/OMAP-L1x USB Compliance Checklist
    PDF, 89 Kb, 档案已发布: Mar 12, 2009
    This application report contains the USB checklist for the TMS320C674x/OMAP-L1x (C674x/OMAP-L1x). The C674x/OMAP-L1x has a compliant full-speed USB device port and does not support a low-speed USB device operation.
  • OMAP-L1x/C674x/AM1x SOC Architecture and Throughput Overview
    PDF, 19 Kb, 档案已发布: Feb 12, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://wiki.davincidsp.com/index.php/OMAP-L1x/C674x/AM1x_SOC_Architecture_and_Throughput_Overview. This collection of Wiki articles provide i
  • Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A)
    PDF, 93 Kb, 修订版: A, 档案已发布: Jul 17, 2008
    This application report motivates the way the DDR high-speed timing requirements are now going to be communicated to system designers. The traditional method of using data sheet parameters and simulation models is tedious. The system designer uses this information to evaluate whether timing specifications are met and can be expected to operate reliably.Ultimately, the real question the hardwa
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

制造商分类

  • Semiconductors> Processors> Sitara Processors> ARM9> AM1x