Datasheet Texas Instruments AM26LS33A — 数据表

制造商Texas Instruments
系列AM26LS33A
Datasheet Texas Instruments AM26LS33A

四路差动线路接收器

数据表

AM26LS32Ax, AM26LS33Ax Quadruple Differential Line Receivers datasheet
PDF, 1.4 Mb, 修订版: F, 档案已发布: Sep 19, 2016
从文件中提取

价格

状态

AM26LS33ACDAM26LS33ACDG4AM26LS33ACDRAM26LS33ACDRE4AM26LS33ACDRG4AM26LS33ACNAM26LS33ACNE4
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNo

打包

AM26LS33ACDAM26LS33ACDG4AM26LS33ACDRAM26LS33ACDRE4AM26LS33ACDRG4AM26LS33ACNAM26LS33ACNE4
N1234567
Pin16161616161616
Package TypeDDDDDNN
Industry STD TermSOICSOICSOICSOICSOICPDIPPDIP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDIP-TR-PDIP-T
Package QTY40402500250025002525
CarrierTUBETUBELARGE T&RLARGE T&RLARGE T&RTUBETUBE
Device Marking26LS33AC26LS33AC26LS33AC26LS33AC26LS33ACAM26LS33ACNAM26LS33ACN
Width (mm)3.913.913.913.913.916.356.35
Length (mm)9.99.99.99.99.919.319.3
Thickness (mm)1.581.581.581.581.583.93.9
Pitch (mm)1.271.271.271.271.272.542.54
Max Height (mm)1.751.751.751.751.755.085.08
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参数化

Parameters / ModelsAM26LS33ACD
AM26LS33ACD
AM26LS33ACDG4
AM26LS33ACDG4
AM26LS33ACDR
AM26LS33ACDR
AM26LS33ACDRE4
AM26LS33ACDRE4
AM26LS33ACDRG4
AM26LS33ACDRG4
AM26LS33ACN
AM26LS33ACN
AM26LS33ACNE4
AM26LS33ACNE4
ICC(Max), mA70707070707070
Operating Temperature Range, C0 to 700 to 700 to 700 to 700 to 700 to 700 to 70
Package GroupSOICSOICSOICSOICSOICPDIPPDIP
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Supply Voltage(s), V5555555

生态计划

AM26LS33ACDAM26LS33ACDG4AM26LS33ACDRAM26LS33ACDRE4AM26LS33ACDRG4AM26LS33ACNAM26LS33ACNE4
RoHSCompliantCompliantCompliantCompliantCompliantCompliantCompliant
Pb FreeYesYes

应用须知

  • Wave Solder Exposure of SMT Packages
    PDF, 206 Kb, 档案已发布: Sep 9, 2008
    It is common practice to attach surface mount components to the underside of a printed circuit board (PCB) by processing the PCB through a wave soldering operation after gluing the components to the PCB. This paper ummarizes results of several tests performed to understand the performance of surface mount components when exposed to the conditions outlined in JESD22A111.

模型线

制造商分类

  • Semiconductors> Interface> RS-422 Transceivers