Datasheet Texas Instruments AM26LV32 — 数据表
| 制造商 | Texas Instruments |
| 系列 | AM26LV32 |
低压高速四路差分线路接收器
数据表
AM26LV32 Low-Voltage, High-Speed Quadruple Differential Line Receiver datasheet
PDF, 1.0 Mb, 修订版: F, 档案已发布: Nov 18, 2016
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价格
状态
| AM26LV32CD | AM26LV32CDE4 | AM26LV32CDG4 | AM26LV32CDR | AM26LV32CDRE4 | AM26LV32CDRG4 | AM26LV32CNSLE | AM26LV32CNSR | AM26LV32CNSRG4 | AM26LV32ID | AM26LV32IDE4 | AM26LV32IDG4 | AM26LV32IDR | AM26LV32INS | AM26LV32INSG4 | AM26LV32INSR | AM26LV32INSRG4 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Obsolete (Manufacturer has discontinued the production of the device) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes | No | No | No | No | No | No | No | No | Yes | No | No | No | Yes | Yes | Yes | Yes |
打包
| AM26LV32CD | AM26LV32CDE4 | AM26LV32CDG4 | AM26LV32CDR | AM26LV32CDRE4 | AM26LV32CDRG4 | AM26LV32CNSLE | AM26LV32CNSR | AM26LV32CNSRG4 | AM26LV32ID | AM26LV32IDE4 | AM26LV32IDG4 | AM26LV32IDR | AM26LV32INS | AM26LV32INSG4 | AM26LV32INSR | AM26LV32INSRG4 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 | 16 | 17 |
| Pin | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Package Type | D | D | D | D | D | D | NS | NS | NS | D | D | D | D | NS | NS | NS | NS |
| Industry STD Term | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOP | SOP | SOP | SOIC | SOIC | SOIC | SOIC | SOP | SOP | SOP | SOP |
| JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
| Package QTY | 40 | 40 | 40 | 2500 | 2500 | 2500 | 2000 | 2000 | 40 | 40 | 40 | 2500 | 50 | 50 | 2000 | 2000 | |
| Carrier | TUBE | TUBE | TUBE | LARGE T&R | LARGE T&R | LARGE T&R | LARGE T&R | LARGE T&R | TUBE | TUBE | TUBE | LARGE T&R | TUBE | TUBE | LARGE T&R | LARGE T&R | |
| Device Marking | AM26LV32C | AM26LV32C | AM26LV32C | AM26LV32C | AM26LV32C | AM26LV32C | 26LV32 | 26LV32 | AM26LV32I | AM26LV32I | AM26LV32I | AM26LV32I | 26LV32I | 26LV32I | 26LV32I | 26LV32I | |
| Width (mm) | 3.91 | 3.91 | 3.91 | 3.91 | 3.91 | 3.91 | 5.3 | 5.3 | 5.3 | 3.91 | 3.91 | 3.91 | 3.91 | 5.3 | 5.3 | 5.3 | 5.3 |
| Length (mm) | 9.9 | 9.9 | 9.9 | 9.9 | 9.9 | 9.9 | 10.3 | 10.3 | 10.3 | 9.9 | 9.9 | 9.9 | 9.9 | 10.3 | 10.3 | 10.3 | 10.3 |
| Thickness (mm) | 1.58 | 1.58 | 1.58 | 1.58 | 1.58 | 1.58 | 1.95 | 1.95 | 1.95 | 1.58 | 1.58 | 1.58 | 1.58 | 1.95 | 1.95 | 1.95 | 1.95 |
| Pitch (mm) | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 | 1.27 |
| Max Height (mm) | 1.75 | 1.75 | 1.75 | 1.75 | 1.75 | 1.75 | 2 | 2 | 2 | 1.75 | 1.75 | 1.75 | 1.75 | 2 | 2 | 2 | 2 |
| Mechanical Data | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 |
参数化
| Parameters / Models | AM26LV32CD | AM26LV32CDE4 | AM26LV32CDG4 | AM26LV32CDR | AM26LV32CDRE4 | AM26LV32CDRG4 | AM26LV32CNSLE | AM26LV32CNSR | AM26LV32CNSRG4 | AM26LV32ID | AM26LV32IDE4 | AM26LV32IDG4 | AM26LV32IDR | AM26LV32INS | AM26LV32INSG4 | AM26LV32INSR | AM26LV32INSRG4 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| # of TX/RX | 0 TX / 4 RX | ||||||||||||||||
| Approx. Price (US$) | 0.47 | 1ku | ||||||||||||||||
| ESD(kV) | 2 | ||||||||||||||||
| Footprint | AM26LS32 | ||||||||||||||||
| ICC(Max), mA | 17 | 17 | 17 | 17 | 17 | 17 | 17 | 17 | 17 | 17 | 17 | 17 | 17 | 17 | 17 | 17 | |
| ICC(Max)(mA) | 17 | ||||||||||||||||
| Operating Temperature Range, C | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | -40 to 85,0 to 70 | |
| Operating Temperature Range(C) | -40 to 85 0 to 70 | ||||||||||||||||
| Package Group | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SO | SO | SO | SOIC | SOIC | SOIC | SOIC | SO | SO | SO | SO |
| Package Size: mm2:W x L (PKG) | 16SOIC: 59 mm2: 6 x 9.9(SOIC) | ||||||||||||||||
| Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
| Receiver tpd(ns) | 16 | ||||||||||||||||
| Receivers Per Package | 4 | ||||||||||||||||
| Signaling Rate, Mbps | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | |
| Signaling Rate(Mbps) | 32 | ||||||||||||||||
| Supply Voltage(s), V | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | 3.3 | |
| Supply Voltage(s)(V) | 3.3 |
生态计划
| AM26LV32CD | AM26LV32CDE4 | AM26LV32CDG4 | AM26LV32CDR | AM26LV32CDRE4 | AM26LV32CDRG4 | AM26LV32CNSLE | AM26LV32CNSR | AM26LV32CNSRG4 | AM26LV32ID | AM26LV32IDE4 | AM26LV32IDG4 | AM26LV32IDR | AM26LV32INS | AM26LV32INSG4 | AM26LV32INSR | AM26LV32INSRG4 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Not Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Pb Free | No |
应用须知
- Wave Solder Exposure of SMT PackagesPDF, 206 Kb, 档案已发布: Sep 9, 2008
It is common practice to attach surface mount components to the underside of a printed circuit board (PCB) by processing the PCB through a wave soldering operation after gluing the components to the PCB. This paper ummarizes results of several tests performed to understand the performance of surface mount components when exposed to the conditions outlined in JESD22A111.
模型线
系列: AM26LV32 (17)
制造商分类
- Semiconductors> Interface> RS-422 Transceivers