Datasheet Texas Instruments AM3352BZCE60 — 数据表
制造商 | Texas Instruments |
系列 | AM3352 |
零件号 | AM3352BZCE60 |
Sitara处理器:ARM Cortex-A8、1 Gb以太网,显示298-NFBGA 0至90
数据表
价格
状态
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | Yes |
打包
Pin | 298 |
Package Type | ZCE |
Industry STD Term | NFBGA |
JEDEC Code | S-PBGA-N |
Package QTY | 160 |
Carrier | JEDEC TRAY (5+1) |
Device Marking | AM3352BZCE60 |
Width (mm) | 13 |
Length (mm) | 13 |
Thickness (mm) | .89 |
Pitch (mm) | .65 |
Max Height (mm) | 1.3 |
Mechanical Data | 下载 |
参数化
ARM CPU | 1 ARM Cortex-A8 |
ARM MHz | 300,600,800,1000 Max. |
Applications | Automotive,Industrial,Personal Electronics |
Co-Processor | N/A s |
DMIPS | 600,1200,1600,2000 |
DRAM | DDR2,DDR3,DDR3L,LPDDR |
Display Outputs | 1 |
EMAC | 2-Port 1Gb Switch |
On-Chip L2 Cache | 256 KB (ARM Cortex-A8) |
Operating Systems | Android,Linux,Windows Embedded CE |
Operating Temperature Range | -40 to 125,-40 to 90,-40 to 105,0 to 90,to C |
Other On-Chip Memory | 128 KB |
Rating | Catalog |
Security Enabler | Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment |
Serial I/O | CAN,I2C,SPI,UART,USB |
生态计划
RoHS | Compliant |
设计套件和评估模块
- Daughter Cards: WL1835MODCOM8B
WiLinkВ™ 8 Module 2.4 GHz WiFiВ® + BluetoothВ® COM8 Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - Daughter Cards: WL1837MODCOM8I
WiLinkВ™ 8 Dual Band 2.4 & 5 GHz Wi-FiВ® + BluetoothВ® COM8 Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: TMDSSK3358
AM335x Starter Kit
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: BEAGLEBK
BeagleBone Black Development Board
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: TMDXEVM3358
AM335x Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
XDS560v2 System Trace USB Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
XDS560v2 System Trace USB & Ethernet Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU200-U
XDS200 USB Debug Probe
Lifecycle Status: Active (Recommended for new designs)
应用须知
- AM335x Power Estimation ToolPDF, 84 Kb, 档案已发布: May 31, 2017
The Power Estimation ToolPower Estimation Tool (PET) allows you to gain insight into the power consumption of select Sitara processors. The tool includes the ability for you to choose multiple application scenarios and understand the power consumption as well as how advanced power saving techniques can be applied to further reduce overall power consumption. - AM335x Low Power Design Guide (Rev. A)PDF, 300 Kb, 修订版: A, 档案已发布: Feb 28, 2017
This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions. - AM335x and AM43xx Sitara Processors USB Layout Guidelines (Rev. A)PDF, 76 Kb, 修订版: A, 档案已发布: Aug 21, 2014
This application report discusses best-practice layout guidelines when implementing a universal serial bus (USB). - Processor SDK RTOS Customization: Modifying Board library to change UART instancPDF, 783 Kb, 档案已发布: Mar 4, 2016
- AM335x Reliability Considerations in PLC Applications (Rev. A)PDF, 112 Kb, 修订版: A, 档案已发布: Apr 27, 2017
Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application. - AM335x Thermal ConsiderationsPDF, 16 Kb, 档案已发布: Apr 15, 2013
This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation. - Sitara Linux ALSA DSP Microphone Array Voice RecognitionPDF, 529 Kb, 档案已发布: Jun 30, 2017
Voice recognition applications requiring a superior user experience typically use a number of digital signal processing algorithms to filter, clean, and enhance microphone sampled audio. Frequently these systems will employ multiple microphones where more sophisticated algorithms can be used. These systems can leverage a Texas Instruments Digital Signal Processor to offload the complex real-time c - PRU-ICSS Migration Guide: AM335x to AM437xPDF, 59 Kb, 档案已发布: Apr 7, 2017
This migration guide details the Programmable Real-Time Unit (PRU) subsystem hardware differences and outlines software modifications required for porting PRU firmware and ARMВ® code to AM437x. - PRU-ICSS Migration Guide: AM335x to AM57x (Rev. A)PDF, 71 Kb, 修订版: A, 档案已发布: Jul 13, 2017
This software migration guide assists in porting legacy software developed for the Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-CSS) on AM335x to AM57x platforms. - nFBGA Packaging (Rev. B)PDF, 3.1 Mb, 修订版: B, 档案已发布: Nov 13, 2015
This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts. - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
- Processor-SDK RTOS Power Management and MeasurementPDF, 78 Kb, 档案已发布: Aug 2, 2017
Processor-SDK RTOS provides out-of-the-box power management examples that empower customers to tailor Sitara processors’ (ARM and DSP) power-performance points per use case. You can configure all supported operating points and run CPU Idle and Dhrystone benchmarking workloads while employing a minimal kernel with real-time assurance. This application report provides an overview of the Processor-SD - PRU-ICSS Feature ComparisonPDF, 29 Kb, 档案已发布: Jun 5, 2017
This application report documents the feature differences between the PRU subsystems available on different TI processors. - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
- High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
模型线
系列: AM3352 (22)
- AM3352BZCE30 AM3352BZCE30R AM3352BZCE60 AM3352BZCEA30 AM3352BZCEA30R AM3352BZCEA60 AM3352BZCEA60R AM3352BZCED30 AM3352BZCED60 AM3352BZCZ100 AM3352BZCZ30 AM3352BZCZ60 AM3352BZCZ80 AM3352BZCZA100 AM3352BZCZA30 AM3352BZCZA60 AM3352BZCZA80 AM3352BZCZD30 AM3352BZCZD60 AM3352BZCZD80 AM3352BZCZT60 AM3352BZCZT60R
制造商分类
- Semiconductors > Processors > Sitara Processors > ARM Cortex-A8 > AM335x