Datasheet Texas Instruments AM3358 — 数据表
制造商 | Texas Instruments |
系列 | AM3358 |
Sitara处理器
数据表
价格
状态
AM3358BZCZ100 | AM3358BZCZ60 | AM3358BZCZ80 | AM3358BZCZA100 | AM3358BZCZA80 | |
---|---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | Yes | Yes | Yes | No | No |
打包
AM3358BZCZ100 | AM3358BZCZ60 | AM3358BZCZ80 | AM3358BZCZA100 | AM3358BZCZA80 | |
---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 |
Pin | 324 | 324 | 324 | 324 | 324 |
Package Type | ZCZ | ZCZ | ZCZ | ZCZ | ZCZ |
Package QTY | 126 | 126 | 126 | 126 | 126 |
Device Marking | AM3358BZCZ100 | AM3358BZCZ60 | AM3358BZCZ80 | AM3358BZCZA100 | AM3358BZCZA80 |
Width (mm) | 15 | 15 | 15 | 15 | 15 |
Length (mm) | 15 | 15 | 15 | 15 | 15 |
Thickness (mm) | .9 | .9 | .9 | .9 | .9 |
Mechanical Data | 下载 | 下载 | 下载 | 下载 | 下载 |
参数化
Parameters / Models | AM3358BZCZ100 | AM3358BZCZ60 | AM3358BZCZ80 | AM3358BZCZA100 | AM3358BZCZA80 |
---|---|---|---|---|---|
ARM CPU | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 |
ARM MHz, Max. | 600,800,1000 | 600,800,1000 | 600,800,1000 | 600,800,1000 | 600,800,1000 |
Applications | Automotive,Industrial,Personal Electronics | Automotive,Industrial,Personal Electronics | Automotive,Industrial,Personal Electronics | Automotive,Industrial,Personal Electronics | Automotive,Industrial,Personal Electronics |
Co-Processor, s | 2 PRU-ICSS | 2 PRU-ICSS | 2 PRU-ICSS | 2 PRU-ICSS | 2 PRU-ICSS |
DMIPS | 1200,1600,2000 | 1200,1600,2000 | 1200,1600,2000 | 1200,1600,2000 | 1200,1600,2000 |
DRAM | DDR2,DDR3,DDR3L,LPDDR | DDR2,DDR3,DDR3L,LPDDR | DDR2,DDR3,DDR3L,LPDDR | DDR2,DDR3,DDR3L,LPDDR | DDR2,DDR3,DDR3L,LPDDR |
Display Outputs | 1 | 1 | 1 | 1 | 1 |
EMAC | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch |
Graphics Acceleration | 1 3D | 1 3D | 1 3D | 1 3D | 1 3D |
Industrial Protocols | 1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III |
On-Chip L2 Cache | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) |
Operating Systems | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE |
Operating Temperature Range, C | -40 to 105,0 to 90 | -40 to 105,0 to 90 | -40 to 105,0 to 90 | -40 to 105,0 to 90 | -40 to 105,0 to 90 |
Other On-Chip Memory | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog |
Security Enabler | Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment |
Serial I/O | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB |
生态计划
AM3358BZCZ100 | AM3358BZCZ60 | AM3358BZCZ80 | AM3358BZCZA100 | AM3358BZCZA80 | |
---|---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
应用须知
- AM335x Low Power Design Guide (Rev. A)PDF, 300 Kb, 修订版: A, 档案已发布: Feb 28, 2017
This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions. - AM335x Reliability Considerations in PLC Applications (Rev. A)PDF, 112 Kb, 修订版: A, 档案已发布: Apr 27, 2017
Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application. - AM335x and AM43xx Sitara Processors USB Layout Guidelines (Rev. A)PDF, 76 Kb, 修订版: A, 档案已发布: Aug 21, 2014
This application report discusses best-practice layout guidelines when implementing a universal serial bus (USB). - Processor SDK RTOS Customization: Modifying Board library to change UART instancPDF, 783 Kb, 档案已发布: Mar 4, 2016
- AM335x Thermal ConsiderationsPDF, 16 Kb, 档案已发布: Apr 15, 2013
This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation. - nFBGA Packaging (Rev. B)PDF, 3.1 Mb, 修订版: B, 档案已发布: Nov 13, 2015
This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts. - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
- Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
- High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
模型线
系列: AM3358 (5)
制造商分类
- Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM335x