Datasheet Texas Instruments AM3703 — 数据表

制造商	Texas Instruments
系列	AM3703

数据表

价格

状态

打包

参数化

Parameters / Models	AM3703CBC	AM3703CBC100	AM3703CBCA	AM3703CBCD100	AM3703CBP	AM3703CBP100	AM3703CBPA	AM3703CBPD100	AM3703CUS	AM3703CUS100	AM3703CUSA	AM3703CUSD100	AM3703CUSNEST
ARM CPU	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8
ARM MHz, Max.	1000	1000	1000	1000	1000	1000	1000	1000	1000	1000	1000	1000	1000
Applications	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics
DRAM	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR
Display Options	DSS	DSS	DSS	DSS	DSS	DSS	DSS	DSS	DSS	DSS	DSS	DSS	DSS
Graphics Acceleration	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
I2C	4	4	4	4	4	4	4	4	4	4	4	4	4
On-Chip L2 Cache	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)
Operating Systems	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Operating Temperature Range, C	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90
Other On-Chip Memory	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
SPI	4	4	4	4	4	4	4	4	4	4	4	4	4
UART, SCI	4	4	4	4	4	4	4	4	4	4	4	4	4
USB	4	4	4	4	4	4	4	4	4	4	4	4	4
Video Port, Configurable	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output

生态计划

应用须知

• 下载
  AM3715/03 SDRC Subsystem
  PDF, 19 Kb, 档案已发布: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_SDRC_SubsystemThe SDRC subsystem module provides connectivity between the AM37x and SDRAM memory components. The module incl
• 下载
  AM/DM37x Power Estimation Spreadsheet
  PDF, 20 Kb, 档案已发布: Jun 7, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or tocontribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Power_Estimation_SpreadsheetThis article discusses the power consumption of the Texas Instruments AM/DM37x high
• 下载
  AM/DM37x Overview
  PDF, 19 Kb, 档案已发布: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Overview.This document provides an overview of the AM37x applications processor.All trademarks are property of their respective
• 下载
  AM3715/03 Memory Subsystem
  PDF, 19 Kb, 档案已发布: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_Memory_SubsystemThe Memory Subsystem in the AM3715/03 devices consists of the internal SRAM and two dedicated memory contr
• 下载
  AM37x/DM37x Schematic Checklist
  PDF, 19 Kb, 档案已发布: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x/DM37x_Schematic_Checklist.This article provides many tips related to reset, JTAG, peripherals, etc. It should be used as
• 下载
  AM37x EVM Software Developer's Guide
  PDF, 19 Kb, 档案已发布: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_EVM_Software_Developer%27s_Guide.This wiki article illustrates the various software components provided with the A
• 下载
  PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs
  PDF, 739 Kb, 档案已发布: Jun 15, 2011
  The purpose of a power distribution network (PDN) is to provide clean and reliable power to active devices in the system. The printed circuit board (PCB) is a critical component of the system-level PDN. Therefore, the PCB design is of utmost importance for high-performance low-power microprocessors. This application report provides design requirements and details a step-by-step methodology on how
• 下载
  Ethernet Connectivity via GPMC
  PDF, 19 Kb, 档案已发布: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Ethernet_Connectivity_via_GPMCThe purpose of this article is to describe a solution for connecting Ethernet to various devices,
• 下载
  Setting up AM37x SDRC Registers
  PDF, 19 Kb, 档案已发布: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Setting_up_AM37x_SDRC_registersThis wiki article describes how to set the SDRC registers in the OMAP35x SDRC module depending o
• 下载
  AM37x CUS Routing Guidelines
  PDF, 19 Kb, 档案已发布: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_CUS_Routing_Guidelines.CUS package is designed with a new technology called Via Channelв„ў array. This technology allows for e
• 下载
  OMAP35x to AM37x Hardware Migration Guide
  PDF, 37 Kb, 档案已发布: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

  http://processors.wiki.ti.com/index.php/OMAP35x_To_AM37x_Hardware_Migration_Guide.

  The OMAP35x to AM37x Hardware Migration Guide describes device consideratio

• 下载
  PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)
  PDF, 2.4 Mb, 修订版: A, 档案已发布: Nov 1, 2013
  Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.

  PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char

• 下载
  PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)
  PDF, 6.7 Mb, 修订版: B, 档案已发布: Jun 13, 2009
  Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
• 下载
  PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
  PDF, 2.0 Mb, 档案已发布: Jun 23, 2010
  Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

  Fine-pitch PCB design is a team effort and may require more than

• 下载
  PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
  PDF, 1.2 Mb, 档案已发布: Jun 23, 2010
  Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process

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• Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM3x