Datasheet Texas Instruments AM3892CCYG120 — 数据表

制造商Texas Instruments
系列AM3892
零件号AM3892CCYG120
Datasheet Texas Instruments AM3892CCYG120

Sitara处理器:ARM Cortex-A8,HDMI 1031-FCBGA 0至95

数据表

AM389x Sitara ARM Microprocessors (MPUs) datasheet
PDF, 2.3 Mb, 修订版: G, 档案已发布: Mar 17, 2015
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin10311031
Package TypeCYGCYG
Industry STD TermFCBGAFCBGA
JEDEC CodeS-PBGA-NS-PBGA-N
Package QTY4444
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device Marking120AM3892CCYG
Width (mm)2525
Length (mm)2525
Thickness (mm)2.812.81
Pitch (mm).65.65
Max Height (mm)3.313.31
Mechanical Data下载下载

参数化

ARM CPU1 ARM Cortex-A8
ARM MHz1350 Max.
ApplicationsCommunications Equipment,Enterprise Systems,Industrial,Personal Electronics
DRAMDDR2,DDR3
Display OptionsHDVPSS
EMAC10/100/1000
Graphics AccelerationN/A
I2C2
On-Chip L2 Cache256 KB (ARM Cortex-A8)
Operating SystemsAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Operating Temperature Range0 to 95 C
Other On-Chip Memory576 KB
RatingCatalog
SPI1
UART3 SCI
USB2
Video Port1 HDMI TX,2 Input,2 Output,3 HD DACS,4 SD DACs Configurable

生态计划

RoHSCompliant

设计套件和评估模块

  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: TMDXEVM8168
    DM816x/AM389x Evaluation Module
    Lifecycle Status: Obsolete (Manufacturer has discontinued the production of the device)

应用须知

  • DM816x, C6A816x, and AM389x Overview
    PDF, 29 Kb, 档案已发布: Jul 7, 2011
    This article provides an overview of the DM816x, C6A816x, and AM389x product families and has been contributed to the TI Embedded Processors Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/DM816x_C6A816x_AM389x_OverviewAll t
  • TMS320DM816x/C6A816x/AM389x DDR3 Initialization With Software Leveling
    PDF, 21 Kb, 档案已发布: Mar 1, 2011
    This article has been contributed to the TI Embedded Processors Wiki. The article describes how to initialize the DDR3 on the TMS320DM816x DaVinciв„ў digital media processors, TMS320C6A816x Integraв„ў DSP+ ARMВ® processors, and AM389x Sitaraв„ў ARMВ® microprocessors (MPUs) PG1.1 samples using the software leveling process.To see the most recently updated version or to cont
  • PCIe to USB on the TMS320DM816x/TMS320C6A816x/AM389x Evaluation Board
    PDF, 22 Kb, 档案已发布: Mar 1, 2011
    This article has been contributed to the TI Embedded Processors Wiki. The article describes using the PCI ExpressВ® ( PCIeВ®) to the USB host controller card on the TMS320DM816x DaVinciв„ў digital media processors, TMS320C6A816x Integraв„ў DSP+ ARMВ® processors, and AM389x Sitaraв„ў ARMВ® microprocessors (MPUs) family of devices running Linux kernel from a PSP package. This
  • TMS320DM816x/TMS320C6A816x/AM389x Power Estimation Spreadsheet
    PDF, 30 Kb, 档案已发布: May 18, 2011
    This article has been contributed to the TI Embedded Processors Wiki. It describes how to model power consumption for a user's application and to present some measured power scenarios for the TMS320DM816x DaVinciв„ў digital media processors, TMS320C6A816x C6-Integraв„ў DSP+ARM processors, and AM389x Sitaraв„ў ARMВ® microprocessors (MPUs) PG1.0 samples using a provided power estimati
  • DM816xx Easy CYG Package PCB Escape Routing (Rev. A)
    PDF, 675 Kb, 修订版: A, 档案已发布: Mar 19, 2015
    The DM816x CYG package is designed with a new technology called a Via Channelв„ў array. This technology allows for easy routing of the device in two signal and two power layers using large throughhole via diameters and standard trace widths; it is cost and time effective. Where more than four printed circuit board (PCB) layers are used, the routing is much more open and flexible than a regular
  • 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
    PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

系列: AM3892 (2)

制造商分类

  • Semiconductors > Processors > Sitara Processors > ARM Cortex-A8 > AM3x